Eric Distefano

US Patent:

6437983, Aug 20, 2002

Filed:

Jun 29, 2001

Appl. No.:

09/895507

Inventors:

Sridhar V. Machiroutu - Santa Clara CA
Eric Distefano - Livermore CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05H 720

US Classification:

361700, 16510426, 16510433, 174 152, 257715, 361701

Abstract:

A system including a vapor chamber including a liquid. The vapor chamber is coupled with a die. The vapor chamber is attached to a plurality of micro pipes (MPs). When heat is generated by the die, the liquid is vaporized in the vapor chamber generating vapor. The vapor flows through the MPs to condensation ends of the MPs.

US Patent:

6459573, Oct 1, 2002

Filed:

Jun 28, 2000

Appl. No.:

09/606793

Inventors:

Eric DiStefano - Livermore CA
Krishna Seshan - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 120

US Classification:

361687, 361680, 361683, 400682

Abstract:

A mobile computer comprising a lower panel, a top panel, side panels, a plurality of keyboard keys and a computer screen. The lower panel can be located on a horizontal surface. The top panel is vertically spaced from the lower panel. The side panels are located between the lower panel and the top panel. The panels define a housing. The top and side panels, while remaining attached to the lower panel, are movable relative to the lower panel between a lower position and an elevated position wherein a gap opens up between the side panels and the lower panel. The keys are located on the housing. The computer screen is mounted to the housing.

US Patent:

6469893, Oct 22, 2002

Filed:

Sep 29, 2000

Appl. No.:

09/675314

Inventors:

Kris Frutschy - Phoenix AZ
Ravi Prasher - Phoenix AZ
Eric Distefano - Livermore CA
Ajit Sathe - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361700, 165 802, 16510433, 174 152, 257715, 257719, 361704

Abstract:

An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

US Patent:

6570764, May 27, 2003

Filed:

Dec 29, 1999

Appl. No.:

09/474791

Inventors:

Rakesh Bhatia - Austin TX
Eric DiStefano - Livermore CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361705, 174 163, 361719

Abstract:

A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

US Patent:

6577502, Jun 10, 2003

Filed:

Jun 28, 2000

Appl. No.:

09/605918

Inventors:

Eric DiStefano - Livermore CA
Krishna Seshan - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 120

US Classification:

361687, 361683, 361693

Abstract:

A mobile computer comprising a lower panel, a top panel, side panels, an electrical computer component, a plurality of keyboard keys, and a computer screen. The lower panel can be located over a horizontal surface. The top panel is vertically spaced from the lower panel. The side panels extend between the lower panel and the top panel. The panels define a housing. An air inlet opening is formed into the housing and an air outlet opening is formed at a higher elevation than the air inlet opening out of the housing. The electrical computer component is located within the housing. Power up of the component causes heating thereof. Air follows a natural convection path being through the air inlet opening into the housing, over the component, and out of the housing through the air outlet opening. The keys are located on the housing. The computer screen is mounted to the housing.

US Patent:

6595022, Jul 22, 2003

Filed:

Jun 27, 2001

Appl. No.:

09/894192

Inventors:

Himanshu Pokharna - San Jose CA
Eric Distefano - Livermore CA
Joseph D. Walters - Santa Clara CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F25B 1708

US Classification:

62480, 62141, 361688

Abstract:

A computer system is described having a refrigeration cycle for a logic processor each utilizes first and second refrigeration cycles, each including a respective adsorber/desorber. Each adsorber/desorber is alternatingly cooled and heated. A liquid is adsorbed into the adsorber/desorber when being cooled and desorbed when the adsorber/desorber is heated. When the liquid is desorbed from the adsorber/desorber, and a checkvalve is closed, a pressure of the liquid increases. The adsorber/desorber together with the checkvalve act as a compressor in the respective refrigeration cycle. Heating and cooling is alternated so that one adsorber/desorber always adsorbs liquid while the other adsorber/desorber desorbes liquid. Thermal swings of the logic processor are thereby avoided.

US Patent:

6625022, Sep 23, 2003

Filed:

Sep 21, 2001

Appl. No.:

09/962954

Inventors:

Kris Frutschy - Phoenix AZ
Ravi Prasher - Phoenix AZ
Eric Distefano - Livermore CA
Ajit Sathe - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361700, 165 802, 16510433, 174 152, 257715, 257719, 361704

Abstract:

An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

US Patent:

6674640, Jan 6, 2004

Filed:

Jul 2, 2001

Appl. No.:

09/895465

Inventors:

Himanshu Pokharna - San Jose CA
Eric Distefano - Livermore CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 721

US Classification:

361687, 361686, 454184, 16510433, 16510432

Abstract:

A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.