Broadcom Mar 2015 - Feb 2016
Staff Ii Engineer, Ic Assembly and Package Development
Broadcom Mar 2015 - Feb 2016
R and D Engineer, Ic Package Engineering
Broadcom Mar 2013 - Feb 2015
Staff I Engineer, Ic Assembly and Package Development
Broadcom Aug 2010 - Feb 2013
Engineer, Ic Assembly and Package Development
Appliedmicro Oct 2008 - Jul 2010
Packaging Intern
Education:
Uc San Diego 2005 - 2010
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Ic Failure Analysis Semiconductors R&D Mechanical Engineering Ic Packaging Integrated Circuits Cadence Apd Autocad Asic