Eric W Lau

US Patent:

20220379428, Dec 1, 2022

Filed:

Jun 1, 2021

Appl. No.:

17/335868

Inventors:

- Santa Clara CA, US
Brian J. BROWN - Palo Alto CA, US
Eric LAU - Santa Clara CA, US
Ekaterina MIKHAYLICHENKO - San Jose CA, US
Jeonghoon OH - Saratoga CA, US
Gerald J. ALONZO - Los Gatos CA, US

International Classification:

B24B 37/10
B24B 37/04
H01L 21/306

Abstract:

Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

US Patent:

20220339755, Oct 27, 2022

Filed:

Jun 28, 2022

Appl. No.:

17/851497

Inventors:

- Santa Clara CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Eric LAU - Santa Clara CA, US
Andrew NAGENGAST - Sunnyvale CA, US
Steven M. ZUNIGA - Soquel CA, US
Edwin C. SUAREZ - Fremont CA, US
Huanbo ZHANG - San Jose CA, US
Brian J. BROWN - Palo Alto CA, US

International Classification:

B24B 37/32
H01L 21/687

Abstract:

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

US Patent:

20190099857, Apr 4, 2019

Filed:

Oct 2, 2018

Appl. No.:

16/149939

Inventors:

- Santa Clara CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Eric LAU - Santa Clara CA, US
Andrew NAGENGAST - Sunnyvale CA, US
Steven M. ZUNIGA - Soquel CA, US
Edwin C. SUAREZ - Fremont CA, US
Huanbo ZHANG - San Jose CA, US
Brian J. BROWN - Palo Alto CA, US

International Classification:

B24B 37/32
H01L 21/687

Abstract:

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

US Patent:

20170274498, Sep 28, 2017

Filed:

Mar 17, 2017

Appl. No.:

15/461944

Inventors:

Jeonghoon Oh - Saratoga CA, US
Edwin C. Suarez - Fremont CA, US
Jason Garcheung Fung - Santa Clara CA, US
Eric Lau - Santa Clara CA, US
King Yi Heung - Santa Clara CA, US
Ashwin Murugappan Chockalingam - San Jose CA, US
Daniel Redfield - Morgan Hill CA, US
Charles C. Garretson - Sunnyvale CA, US
Thomas H. Osterheld - Mountain View CA, US

International Classification:

B24B 37/26
B24B 37/10

Abstract:

A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.

US Patent:

20170203405, Jul 20, 2017

Filed:

Jan 20, 2016

Appl. No.:

15/002193

Inventors:

- Santa Clara CA, US
Steven M. Zuniga - Soquel CA, US
Hung Chih Chen - Sunnyvale CA, US
Eric Lau - Santa Clara CA, US
Garrett Ho Yee Sin - Sunnyvale CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 37/20
B24B 37/30

Abstract:

A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.

US Patent:

20160016280, Jan 21, 2016

Filed:

Jul 17, 2014

Appl. No.:

14/334608

Inventors:

- Santa Clara CA, US
Paul D. Butterfield - San Jose CA, US
Jay Gurusamy - Santa Clara CA, US
Jason Garcheung Fung - Santa Clara CA, US
Jimin Zhang - San Jose CA, US
Eric Lau - Santa Clara CA, US

International Classification:

B24B 37/10
H01L 21/768
H01L 21/67

Abstract:

A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.