Eric C Lau

US Patent:

20220379428, Dec 1, 2022

Filed:

Jun 1, 2021

Appl. No.:

17/335868

Inventors:

- Santa Clara CA, US
Brian J. BROWN - Palo Alto CA, US
Eric LAU - Santa Clara CA, US
Ekaterina MIKHAYLICHENKO - San Jose CA, US
Jeonghoon OH - Saratoga CA, US
Gerald J. ALONZO - Los Gatos CA, US

International Classification:

B24B 37/10
B24B 37/04
H01L 21/306

Abstract:

Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.

US Patent:

20220339755, Oct 27, 2022

Filed:

Jun 28, 2022

Appl. No.:

17/851497

Inventors:

- Santa Clara CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Eric LAU - Santa Clara CA, US
Andrew NAGENGAST - Sunnyvale CA, US
Steven M. ZUNIGA - Soquel CA, US
Edwin C. SUAREZ - Fremont CA, US
Huanbo ZHANG - San Jose CA, US
Brian J. BROWN - Palo Alto CA, US

International Classification:

B24B 37/32
H01L 21/687

Abstract:

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

US Patent:

20190099857, Apr 4, 2019

Filed:

Oct 2, 2018

Appl. No.:

16/149939

Inventors:

- Santa Clara CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Eric LAU - Santa Clara CA, US
Andrew NAGENGAST - Sunnyvale CA, US
Steven M. ZUNIGA - Soquel CA, US
Edwin C. SUAREZ - Fremont CA, US
Huanbo ZHANG - San Jose CA, US
Brian J. BROWN - Palo Alto CA, US

International Classification:

B24B 37/32
H01L 21/687

Abstract:

Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.

US Patent:

20160016280, Jan 21, 2016

Filed:

Jul 17, 2014

Appl. No.:

14/334608

Inventors:

- Santa Clara CA, US
Paul D. Butterfield - San Jose CA, US
Jay Gurusamy - Santa Clara CA, US
Jason Garcheung Fung - Santa Clara CA, US
Jimin Zhang - San Jose CA, US
Eric Lau - Santa Clara CA, US

International Classification:

B24B 37/10
H01L 21/768
H01L 21/67

Abstract:

A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.