Eric P Wentzel from 16865 Big Pine Dr, Reno, NV 89511, age 79, Phone: 7757374532

view source

Location:

16865 Big Pine Dr, Reno, NV 89511

Industry:

Computer Networking

Work:

Blackridge Technology
Senior Director, Program Management
Lockheed Martin Sep 1986 - Jun 2008
Senior Manager, Advanced Payload Development

Education:

United States Air Force Academy
Bachelors, Bachelor of Science, Engineering

view source

view source

Heat Transfer Of Processing Systems
view source
US Patent:

8009420, Aug 30, 2011
Filed:

Sep 30, 2009
Appl. No.:

12/571282
Inventors:

Robert J. Hill - Cupertino CA, US
Gary L. Heinz - San Carlos CA, US
Dwayne D. Komush - Livermore CA, US
Bryan J. Chen - Santa Barbara CA, US
James D. Phillips - Palo Alto CA, US
Eric P. Wentzel - Portola Valley CA, US
Assignee:

Lockheed Martin Corporation - Bethesda MD
International Classification:

G06F 1/20
H05K 7/20
US Classification:

36167954, 361704, 361707, 361719, 361720, 257686
Abstract:

A processing module may be provided. The processing module may include a mounting member configured to structurally support a first processing unit and receive thermal energy from the first processing unit through a coupling side of the first processing unit by conduction. The processing module may also include a base member coupled to the mounting member. The base member may be configured to receive thermal energy from the mounting member. A thermal conductivity of at least one of the mounting member and the base member may be greater than about 50 Watts/meter Celsius (W/m-C). Coefficients of thermal expansion (CTEs) of the mounting member, the base member, and the coupling side of the first processing unit may be matched.