- Maple Grove MN, US Eric Wespi - Maple Grove MN, US Nicholas Tassoni - Andover MN, US Brian J. Hanson - Shoreview MN, US Gregory Y. Lee - Eden Prairie MN, US Jose A. Meregotte - Blaine MN, US Kevin Windheuser - Hopkinton MA, US John A. Hingston - Framingham MA, US Nolan Hobart - Milford MA, US Michael E. Zupkofska - Rockland MA, US Ryan V. Wales - Northborough MA, US Scott E. Brechbiel - Acton MA, US Rachael Campion - Boston MA, US Tara A. Jarobski - North Oxford MA, US Danny S. Lee - Cambridge MA, US Alexander J. Burnham - Southbury CT, US Christopher K. Oto - Boston MA, US Nicholas J. Mazzola - Hudson MA, US Kevin L. Bagley - Dedham MA, US Shaun D. Comee - Fiskdale MA, US
International Classification:
A61B 17/11 A61B 1/018 A61L 27/36 A61F 2/04
Abstract:
Exemplary embodiments of the present disclosure relate to devices, systems, and methods for tissue resection in a body lumen of a patient, and may include an endoscope and a backstop delivery device extendable through the endoscope. The backstop delivery device may deliver a backstop to a location of selected tissue for resection. A backstop may include a covering being deployable in a patient. The covering may have one or more anchoring mechanisms disposed on an edge of the covering. A tissue resecting device may be extendable through the endoscope for resecting the selected tissue for resection. The covering may be deployable to an outer surface of the body lumen, such that the anchoring mechanism may secure the covering to the outer surface of the body lumen and the covering may expand to cover the selected tissue for resection.
Boston Scientific
Data Scientist
Boston Scientific
Process Development Engineer
Boston Scientific Sep 2015 - Sep 2016
Mfg Engineer
Intel Corporation Jul 2005 - Aug 2015
Wet Etch Process Engineer
Education:
Arizona State University - W. P. Carey School of Business 2009 - 2010
Master of Business Administration, Masters, International Business
University of Minnesota 2001 - 2005
Bachelors, Bachelor of Science, Chemical Engineering
Skills:
Design of Experiments Manufacturing Jmp Semiconductors Cross Functional Team Leadership Yield Spc Semiconductor Industry Process Engineering Python Data Visualization Failure Analysis Lean Manufacturing Product Engineering Thin Films Statistical Process Control Characterization Process Simulation Process Integration Silicon Etching Neo4J Ic Cypher Data Science