12715 Peregrine Way, Colorado Springs, CO 80908 • 7192872934 • 7194952934
16715 Peregrine Way, Colorado Springs, CO 80908
8325 Kirk Dr, Colorado Springs, CO 80908 • 7194952934
4185 Scotch Pine Dr, Colorado Springs, CO 80920 • 7194952934
16810 Papago Way, Colorado Springs, CO 80908 • 7194952934
1850 Ramtron Dr, Colorado Springs, CO 80921
5950 Vista Ridge Pt #301, Colorado Springs, CO 80918
Colorado Spgs, CO
Oak Harbor, WA
445 Waupelani Dr #1, State College, PA 16801
161 Crescent Ln, Schaumburg, IL 60193
12715 Peregrine Way, Colorado Springs, CO 80908 • 7194952934
Work
Company:
Ramtron
May 2011 to Nov 2012
Position:
Chief technologist
Education
Degree:
Doctorates, Doctor of Philosophy
Skills
Semiconductor Industry • Ic • Soc • Electronics • Asic • Cmos • Mixed Signal • Analog • Engineering Management • Embedded Systems • Cross Functional Team Leadership • Analog Circuit Design • Verilog
Ramtron May 2011 - Nov 2012
Chief Technologist
Cypress Semiconductor Corporation May 2011 - Nov 2012
Senior Director, Technology Development Engineering
Ramtron May 2006 - May 2011
Principal Scientist
Education:
Xianjiaotong University 1984 - 1987
Master of Science, Masters, Engineering
Xianjiaotong University 1978 - 1982
Bachelors, Bachelor of Science, Engineering
Skills:
Semiconductor Industry Ic Soc Electronics Asic Cmos Mixed Signal Analog Engineering Management Embedded Systems Cross Functional Team Leadership Analog Circuit Design Verilog
Us Patents
Method For Manufacturing A Ferroelectric Memory Cell Including Co-Annealing
Fan Chu - Colorado Springs CO Glen Fox - Colorado Springs CO
Assignee:
Ramtron International Corporation - Colorado Springs CO
International Classification:
H01L 2100
US Classification:
438 3
Abstract:
A method for manufacturing a ferroelectric memory cell includes the steps of forming a bottom electrode layer on a substrate, forming a ferroelectric thin film layer on the bottom electrode layer, forming a top electrode on the ferroelectric thin film layer, forming an encapsulating layer on the top electrode, forming a contact hole through the encapsulating layer, and co-annealing the ferroelectric thin film layer and the top electrode after forming the contact hole.
Ferroelectric Semiconductor Memory Device And A Fabrication Process Thereof
Soichiro Ozawa - Kawasaki, JP Shan Sun - Colorado Springs CO Hideyuki Noshiro - Kawasaki, JP George Hickert - Colorado Springs CO Katsuyoshi Matsuura - Kawasaki, JP Fan Chu - Black Forest CO Takeyasu Saito - Kawasaki, JP
Assignee:
Fujitsu Limited - Kawasaki
International Classification:
H01L 2976
US Classification:
257295, 257296
Abstract:
A ferroelectric random access memory has a ferroelectric capacitor formed of a stacking of a lower electrode, a PZT film and an upper electrode of SrRuO , wherein the PZT film includes pinholes, with a pinhole density of about 17/m or less.
Ferroelectric Thin Film Capacitors Having Multi-Layered Crystallographic Textures
Glen Fox - Colorado Springs CO Fan Chu - Colorado Springs CO Brian Eastep - Colorado Springs CO Shan Sun - Colorado Springs CO
Assignee:
Fujitsu Limited - Kawasaki
International Classification:
H01L 27108
US Classification:
257295, 257306
Abstract:
A ferroelectric thin film capacitor and a method for producing the same wherein the capacitor dielectric includes multi-layered crystallographic textures. An integrated circuit device, such as a non-volatile memory device, includes at least one capacitor having a top and bottom electrode thereof and a ferroelectric dielectric layer therebetween. The ferroelectric dielectric layer comprises a first ferroelectric layer having a first crystallographic texture forming a main body of the dielectric layer and a second ferroelectric layer having a second differing crystallographic texture forming an interface layer between the main body and one of the top and bottom electrodes.
Ferroelectric Semiconductor Memory Device And A Fabrication Process Thereof
Soichiro Ozawa - Kawasaki, JP Shan Sun - Colorado Springs CO Hideyuki Noshiro - Kawasaki, JP George Hickert - Colorado Springs CO Katsuyoshi Matsuura - Kawasaki, JP Fan Chu - Black Forest CO Takeyasu Saito - Kawasaki, JP
Assignee:
Fujitsu Limited - Kawasaki
International Classification:
H01L 218242
US Classification:
438240, 438 3, 438250, 438393
Abstract:
A ferroelectric random access memory has a ferroelectric capacitor formed of a stacking of a lower electrode, a PZT film and an upper electrode of SrRuO , wherein the PZT film includes pinholes, with a pinhole density of about 17 m or less.
Process For Producing High Quality Pzt Films For Ferroelectric Memory Integrated Circuits
Glen Fox - Colorado Springs CO, US Fan Chu - Colorado Springs CO, US Brian Eastep - Colorado Springs CO, US Tomohiro Takamatsu - Iwate, JP Yoshimasa Horii - Iwate, JP Ko Nakamura - Kanagawa, JP
Assignee:
Fujitsu Limited - Kawasaki
International Classification:
H01L021/00
US Classification:
438 3, 438239, 438240, 438957
Abstract:
A method for fabrication of ferroelectric capacitor elements of an integrated circuit includes steps of deposition of an electrically conductive bottom electrode layer, preferably made of a noble metal. The bottom electrode is covered with a layer of ferroelectric dielectric material. The ferroelectric dielectric is annealed with a first anneal prior to depositing a second electrode layer comprising a noble metal oxide. Deposition of the electrically conductive top electrode layer is followed by annealing the layer of ferroelectric dielectric material and the top electrode layer with a second anneal. The first and the second anneal are performed by rapid thermal annealing.
Semiconductor Device Having A Ferroelectric Capacitor And A Fabrication Process Thereof
Katsuyoshi Matsuura - Kawasaki, JP Mari Tani - Kawasaki, JP Yoshimasa Horii - Kawasaki, JP Fan Chu - Colorado Springs CO, US Glen R. Fox - Colorado Springs CO, US Brian Eastep - Colorado Springs CO, US
Assignee:
Fujitsu Limited - Kawasaki
International Classification:
H01L021/00 H01L021/8242
US Classification:
438 3, 438240, 438253, 438381
Abstract:
A method of fabricating a semiconductor device having a ferroelectric capacitor includes the steps of forming a lower electrode layer of the ferroelectric capacitor on an insulation film covering an active device element, forming a ferroelectric film on the lower electrode layer as a capacitor insulation film, crystallizing the ferroelectric film by applying a thermal annealing process in an atmosphere containing a non-oxidizing gas and an oxidizing gas, and forming an upper electrode layer on the ferroelectric film.
Circuit For Generating A Centered Reference Voltage For A 1T/1C Ferroelectric Memory
Shan Sun - Colorado Springs CO, US Xiao-Hong Du - Colorado Springs CO, US Fan Chu - Colorado Springs CO, US Bob Sommervold - Colorado Springs CO, US
Assignee:
Ramtron International Corporation - Colorado Springs CO
International Classification:
G11C 11/22
US Classification:
365145, 365149, 438 3
Abstract:
A ferroelectric reference circuit generates a reference voltage proportional to (P+U)/2 and is automatically centered between the bit line voltages corresponding to the P term and the U term across wide temperature and voltage ranges. To avoid fatiguing the reference ferroelectric capacitors generating (P+U)/2, the reference voltage is refreshed once every millisecond. To eliminate the variation of the reference voltage due to the leakage in the ferroelectric capacitors during this period of time, the reference voltage generated from the reference ferroelectric capacitors is digitized when it is refreshed. The digital value is fixed and converted to an analog value which is then fed into sense amplifiers for resolving the data states. The reference voltage is automatically at the center of the switching (P) and non-switching (U) signals and therefore the signal margin is maximized.
Circuit For Generating A Centered Reference Voltage For A 1T/1C Ferroelectric Memory
Shan Sun - Colorado Springs CO, US Xiao-Hong Du - Colorado Springs CO, US Fan Chu - Colorado Springs CO, US Bob Sommervold - Colorado Springs CO, US
Assignee:
Ramtron International Corporation - Colorado Springs CO
International Classification:
G11C 11/22
US Classification:
365145, 365149, 438 3
Abstract:
A ferroelectric reference circuit generates a reference voltage proportional to (P+U)/2 and is automatically centered between the bit line voltages corresponding to the P term and the U term across wide temperature and voltage ranges. To avoid fatiguing the reference ferroelectric capacitors generating (P+U)/2, the reference voltage is refreshed once every millisecond. To eliminate the variation of the reference voltage due to the leakage in the ferroelectric capacitors during this period of time, the reference voltage generated from the reference ferroelectric capacitors is digitized when it is refreshed. The digital value is fixed and converted to an analog value which is then fed into sense amplifiers for resolving the data states. The reference voltage is automatically at the center of the switching (P) and non-switching (U) signals and therefore the signal margin is maximized.