Darin Wagner - Chandler AZ, US Daniel DelVecchio - Tempe AZ, US William Spink - Goodyear AZ, US John Bohlin - Palm Bay FL, US Federico Calderon - Palm Bay FL, US
Assignee:
Trompeter Electronics, Inc. - Mesa AZ
International Classification:
H01R 13/62
US Classification:
439160000
Abstract:
An interconnection module provides a normal-through connection for an electrical signal. The interconnection module includes a housing defining an input and an output, a conductor disposed within the housing provides a signal path between the input and the output, and a removable monitor module mated to the housing. The monitor module includes a monitor port and an active circuit for sensing the electrical signal and for providing to the monitor port a monitor signal indicative of the electrical signal. The active circuit is disposed electrically in parallel to the signal path and exhibits an impedance to the signal path that is sufficiently high so that the electrical signal being monitored is not disturbed by the active circuit. The monitor circuit is hot-swappable so that removal or installation of the monitor module from the housing during transmission of the electrical signal through the signal path will not disturb the electrical signal. The interconnection module can be used with digital video signals such as those conforming to the serial data interface (SDI) standard.
Harris Corporation - Melbourne, Florida since Apr 2013
Software Engineer
Education:
Webster University 2011 - 2013
Master of Science (M.Sc.), Computer Science with emphasis in Distributed Systems
University of Central Florida 2001 - 2005
BS Electrical Engineering, Engineering
Skills:
Embedded Systems Electronics Engineering Wireless Test Equipment Failure Analysis Rf Electrical Engineering Fiber Optics Analog Pcb Design Manufacturing Power Supplies Software Development C# Engineering Management Visual Studio Programming Component Engineering Power Electronics Soldering Debugging C Components .Net Testing Semiconductors Spectrum Analyzer Systems Engineering Software Design Digital Signal Processors System Architecture Hardware Architecture Firmware Scrum Asic Embedded Software Sensors Android C++ Microcontrollers Rtos Web Applications Java
Awards:
US Patent - Interconnection and monitoring module Named in US Patent No: 7,393,249 B2, issued July 1, 2008. (http://ip.com/patent/US7393249). Emerson Rocket Award Emerson Network Power Honor received for outstanding creativity, design and implementation of both hardware and software for the 10.3125 Giga-bit-per-second, 850nm Multimode, Low Rider Transceiver. This was a great achievement for the company as when released, it was the only product available in the market to operate in a military aerospace, harsh environment, at industrial temperature ranges with exceptional margin in performance un-cooled.