Francis T Mcquade

US Patent:

6566898, May 20, 2003

Filed:

Sep 17, 2001

Appl. No.:

09/953599

Inventors:

William F. Theissen - Newtown CT
Stephen Evans - Newtown CT
Francis T. McQuade - Watertown CT
Zbigniew Kukielka - Plainville CT

Assignee:

Wentworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of InvarÂ, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The Invar spacers may be composed of Invar foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

US Patent:

6633175, Oct 14, 2003

Filed:

Mar 6, 2000

Appl. No.:

09/519363

Inventors:

Stephen Evans - Newtown CT
Francis T. McQuade - Watertown CT

Assignee:

Wenworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R 3102

US Classification:

324754, 324755

Abstract:

An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of InvarÂ, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer by adhesive. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The Invar spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.

US Patent:

6661244, Dec 9, 2003

Filed:

Jan 30, 2002

Appl. No.:

10/060160

Inventors:

Francis T. McQuade - Watertown CT
Zbigniew Kukielka - Plainville CT
William F. Thiessen - Newtown CT
Stephen Evans - Newtown CT

Assignee:

Wentworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

A probe head assembly for use in a vertical pin probing device of the type used to electrically test integrated circuit devices has a metallic spacer portion formed from a plurality of laminated metallic layers. The laminated metallic layers are formed from a low coefficient of thermal expansion metal, such as Invar, a 36% nickelâ64% iron alloy. By orienting the metallic grains of the laminated metal layers to be off-set from the orientation of metallic grains of adjacent metallic foil layers, increased strength and flatness is achieved.

US Patent:

6906540, Jun 14, 2005

Filed:

Dec 20, 2001

Appl. No.:

10/027146

Inventors:

Francis T. McQuade - Watertown CT, US
Charles L. Barto - Oakville CT, US

Assignee:

Wentworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R031/02

US Classification:

324754

Abstract:

A method of fabricating a plurality of micro probes comprising the steps of defining the shapes of a plurality of probes as a mask, applying a photoresist to a surface of a metal foil, overlaying the mask on the metal foil, exposing the photoresist to light passed through the mask, developing the photoresist, removing a portion of the photoresist to expose a portion of the metal foil, applying an etcher to the surface of the metal foil to remove the exposed portion to produce a plurality of probes, and chemically polishing and plating the plurality of probes.

US Patent:

6977515, Dec 20, 2005

Filed:

Oct 24, 2003

Appl. No.:

10/693201

Inventors:

Francis T. McQuade - Watertown CT, US
Charles L. Barto - Oakville CT, US
Phillip M. Truckle - Newtown CT, US

Assignee:

Wentworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R031/02
H05K003/02

US Classification:

324754, 29846

Abstract:

A method of manufacturing a probe test head for testing of semiconductor integrated circuits includes: defining shapes of a plurality of probes as one or more masks; a step for fabricating the plurality of probes using the mask; and disposing the plurality of probes through corresponding holes in a first die and a second die. The step for fabricating the plurality of probes may include one of photo-etching and photo-defined electroforming.

US Patent:

7282934, Oct 16, 2007

Filed:

Mar 9, 2005

Appl. No.:

11/077537

Inventors:

Dean C. Mazza - Middlebury CT, US
Salvatore Sanzari - Naugatuck CT, US
Jeff P. Ritell - Ridgefield CT, US
Francis T. McQuade - Watertown CT, US

Assignee:

Wentworth Laboratories, Inc. - Brookfield CT

International Classification:

G01R 31/02

US Classification:

324754, 324758, 324755

Abstract:

A space transformer for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit with device under test contact pads formed on a first side and printed circuit board contact pads formed on a second side. Electrically conductive circuit traces extend between the device under test contact pads and the printed circuit board contact pads. A shim plate is fastened to a periphery of the first side of the flexible multilayer circuit and a bottom plate is fastened to a periphery of the second side of the flexible multilayer circuit. The bottom plate has a plurality of internal apertures are aligned with the printed circuit board contact pads separated by bottom plate stanchions that are aligned with the device under test contact pads. A plurality of interconnects are bonded and electrically interconnected to the printed circuit contact pads and extend through the internal apertures.

US Patent:

8264248, Sep 11, 2012

Filed:

Mar 30, 2007

Appl. No.:

11/731453

Inventors:

Francis T McQuade - San Jose CA, US

Assignee:

DSL Labs, Inc. - Fremont CA

International Classification:

G01R 31/00
G01R 1/067

US Classification:

32475506, 32475603, 32475601

Abstract:

Embodiments of the present invention improve probes and probe assemblies. In one embodiment, the present invention includes a probe test head comprising a plurality of novel probes inserted in an array of holes in upper and lower dies of the assembly. The novel assembly includes a novel alignment layer for easy repair and maintenance of the probes.

US Patent:

20080238452, Oct 2, 2008

Filed:

Mar 30, 2007

Appl. No.:

11/731072

Inventors:

Francis T. McQuade - San Jose CA, US

Assignee:

DSL Labs, Incorporated - Fremont CA

International Classification:

G01R 31/02

US Classification:

324754, 324761

Abstract:

Embodiments of the present invention improve probes and probe assemblies. In one embodiment the present invention includes a micro probe comprising a lower contact end including a lower tip, an upper contact end, and a curved intermediate region between the upper contact end and lower contact end. An angle stop is included between the lower contact end and the curved intermediate region, and the lower contact end, upper contact end, and curved intermediate region have a uniform thickness