Frank Rockwell Lowe

US Patent:

6479395, Nov 12, 2002

Filed:

Nov 2, 1999

Appl. No.:

09/432512

Inventors:

John Stephen Smith - Berkeley CA
Mark A. Hadley - Newark CA
Gordon S. W. Craig - Palo Alto CA
Frank Lowe - Berkeley CA

Assignee:

Alien Technology Corporation - Morgan Hill CA

International Classification:

H01L 21302

US Classification:

438723, 438745, 438756

Abstract:

Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a method, each of the elements include an electrical component and are assembled into one of the openings by a fluidic self assembly process. In an particular example of a method to create such an opening, the substrate is etched through a first patterned mask and is later etched through a second patterned mask. Typically, the second patterned mask is aligned relative to the opening created by etching through the first patterned mask and has an area of exposure which is smaller than an area of exposure through the first patterned mask. In another example of a method, a photosensitive material is exposed through a patterned mask to oblique sources of light such that some of the light impinges into a first portion of the photosensitive material which is under the patterned mask, and the patterned mask and a second portion of the photosensitive material, which is under the patterned mask, is removed. In another example of a method, an opening in a first layer, which comprises silicon dioxide, is formed by depositing a second layer over the first layer and depositing a tungsten layer over the second layer.

US Patent:

6623579, Sep 23, 2003

Filed:

Nov 2, 1999

Appl. No.:

09/432291

Inventors:

John Stephen Smith - Berkeley CA
Mark A. Hadley - Newark CA
Gordon S. W. Craig - Palo Alto CA
Frank Lowe - Berkeley CA

Assignee:

Alien Technology Corporation - Morgan Hill CA

International Classification:

B05D 312

US Classification:

156 736, 156293, 427184, 427346

Abstract:

Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction. A method according to another aspect of the invention includes creating a slurry comprising of fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and projecting the slurry through a nozzle toward the substrate. In one particular implementation of this aspect, additional nozzles may be used to provide suction or additional fluid or additional slurry.

US Patent:

7101502, Sep 5, 2006

Filed:

May 23, 2002

Appl. No.:

10/154899

Inventors:

John Stephen Smith - Berkeley CA, US
Mark A. Hadley - Newark CA, US
Gordon S. W. Craig - Palo Alto CA, US
Frank Lowe - Berkeley CA, US

Assignee:

Alien Technology Corporation - Morgan Hill CA

International Classification:

B28B 11/00

US Classification:

264232, 264340, 216 2, 216 18, 216 39

Abstract:

Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a method, each of the elements include an electrical component and are assembled into one of the openings by a fluidic self assembly process. In an particular example of a method to create such an opening, the substrate is etched through a first patterned mask and is later etched through a second patterned mask. Typically, the second patterned mask is aligned relative to the opening created by etching through the first patterned mask and has an area of exposure which is smaller than an area of exposure through the first patterned mask. In another example of a method, a photosensitive material is exposed through a patterned mask to oblique sources of light such that some of the light impinges into a first portion of the photosensitive material which is under the patterned mask, and the patterned mask and a second portion of the photosensitive material, which is under the patterned mask, is removed. In another example of a method, an opening in a first layer, which comprises silicon dioxide, is formed by depositing a second layer over the first layer and depositing a tungsten layer over the second layer.

US Patent:

7172789, Feb 6, 2007

Filed:

Aug 4, 2003

Appl. No.:

10/634350

Inventors:

John Stephen Smith - Berkeley CA, US
Mark A. Hadley - Newark CA, US
Gordon S. W. Craig - Palo Alto CA, US
Frank Lowe - Berkeley CA, US

Assignee:

Alien Technology Corporation - Morgan Hill CA

International Classification:

B05D 5/06

US Classification:

427162, 427 984, 427 985, 427196, 427197, 427256, 427355, 427426

Abstract:

Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element. The method further includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid.

US Patent:

7531218, May 12, 2009

Filed:

Dec 15, 2006

Appl. No.:

11/639858

Inventors:

John Stephen Smith - Berkeley CA, US
Mark A. Hadley - Newark CA, US
Gordon S. W. Craig - Palo Alto CA, US
Frank Lowe - Berkeley CA, US

Assignee:

Alien Technology Corporation - Morgan Hill CA

International Classification:

B05D 3/12

US Classification:

427346, 427201, 427300, 427307, 977882, 977883, 216 22

Abstract:

Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements.

US Patent:

20060249873, Nov 9, 2006

Filed:

Jul 12, 2006

Appl. No.:

11/485687

Inventors:

John Smith - Berkeley CA, US
Mark Hadley - Newark CA, US
Gordon Craig - Palo Alto CA, US
Frank Lowe - Berkeley CA, US

International Classification:

B28B 11/00
B29B 15/00

US Classification:

264232000

Abstract:

Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a method, each of the elements include an electrical component and are assembled into one of the openings by a fluidic self assembly process. In an particular example of a method to create such an opening, the substrate is etched through a first patterned mask and is later etched through a second patterned mask. Typically, the second patterned mask is aligned relative to the opening created by etching through the first patterned mask and has an area of exposure which is smaller than an area of exposure through the first patterned mask. In another example of a method, a photosensitive material is exposed through a patterned mask to oblique sources of light such that some of the light impinges into a first portion of the photosensitive material which is under the patterned mask, and the patterned mask and a second portion of the photosensitive material, which is under the patterned mask, is removed. In another example of a method, an opening in a first layer, which comprises silicon dioxide, is formed by depositing a second layer over the first layer and depositing a tungsten layer over the second layer. The tungsten and second layers are patterned to expose a portion of the first layer, and this portion is etched. Various apparatuses which may be made using these methods are also described.

US Patent:

20190252183, Aug 15, 2019

Filed:

Apr 14, 2019

Appl. No.:

16/383609

Inventors:

- Anyang, KR
Daniel Francis - Oakland CA, US
Frank Yantis Lowe - Phoenix AZ, US
Daniel James Twitchen - High Wycombe, GB

Assignee:

RFHIC Corporation - Anyang

International Classification:

H01L 21/02
C23C 16/27
H01L 29/267
H01L 29/16
H01L 29/20

Abstract:

A method of fabricating a semiconductor device structure includes: providing a substrate comprising a layer of compound semiconductor material; forming a seed layer of nano-crystalline diamond having a layer thickness in a range 5 to 50 nm on the layer of compound semiconductor material; and growing a layer of polycrystalline CVD diamond on the seed layer using a chemical vapour deposition (CVD) technique. An effective thermal boundary resistance (TBR) at an interface between the layer of compound semiconductor material and the layer of polycrystalline CVD diamond material is no more than 50 mK/GW.

US Patent:

20170263448, Sep 14, 2017

Filed:

Dec 9, 2015

Appl. No.:

15/531462

Inventors:

- Gyeonggi-do, KR
Daniel Francis - Oakland CA, US
Frank Yantis Lowe - Phoenix AZ, US
Daniel James Twitchen - High Wycombe, GB

Assignee:

RFHIC Corporation - Anyang

International Classification:

H01L 21/02
H01L 29/16
H01L 29/267
H01L 29/20

Abstract:

A semiconductor device structure comprising: