Frank W Ma

US Patent:

6537011, Mar 25, 2003

Filed:

Jul 31, 2000

Appl. No.:

09/629322

Inventors:

Danny Wang - San Jose CA
Dmitry Lubomirsky - Cupertino CA
Erwin Polar - San Jose CA
Brigitte Stoehr - San Jose CA
Mark Wiltse - Redwood City CA
Frank C. Ma - Scotts Valley CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B65G 4907

US Classification:

414217, 414941, 118728, 118729

Abstract:

A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

US Patent:

8647446, Feb 11, 2014

Filed:

Dec 7, 2011

Appl. No.:

13/313356

Inventors:

Satbir Kahlon - Livermore CA, US
Frank Ma - Scotts Valley CA, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

B08B 5/00

US Classification:

134 31, 134 21, 134 251, 134 254, 134 255, 134 26, 134 30, 134 32, 134 33, 134 34, 134 36, 134 37, 134 42, 134902, 216 58

Abstract:

A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

US Patent:

20130133701, May 30, 2013

Filed:

Nov 28, 2011

Appl. No.:

13/305332

Inventors:

Satbir Kahlon - Livermore CA, US
Frank Ma - Scotts Valley CA, US

Assignee:

Intermolecular, Inc. - San Jose CA

International Classification:

B08B 3/08
B08B 7/04
B08B 5/00

US Classification:

134 30, 134 952

Abstract:

Methods for cleaning a substrate are provided. One such method includes receiving the substrate into a cleaning module and flowing an inert gas into the cleaning module. The flowing of the inert gas includes flowing the inert gas into an inlet defined within a top surface of the cleaning module and modifying a direction of the flowing inert gas to flow radially along the top surface of the cleaning module. Concurrent with or after initiating the flowing of the inert gas, a cleaning chemistry is introduced onto a surface of the substrate. The cleaning chemistry is at a temperature elevated from an ambient temperature. The dispensing of the cleaning chemistry is terminated and the flowing of the inert gas is terminated either concurrent with or after termination of the dispensing of the cleaning chemistry. The substrate is dried after the termination of the flowing of the inert gas.

US Patent:

54134900, May 9, 1995

Filed:

Oct 26, 1993

Appl. No.:

8/142769

Inventors:

Frank C. Ma - Diamond Bar CA
Vincent S. Chen - Walnut CA

Assignee:

Genrife Company Limited

International Classification:

H01R 909

US Classification:

439 76

Abstract:

An I/O card assembly (1) is provided having an insulative frame means (10, 40) sandwiched by a pair of generally similar conductive covers (50, 70). Each cover (50) includes a main plate (52) and two elongated side shielding walls (56) downward extending from two opposite sides of the plate (52) a first distance which is generally half of a height of the side wall (12) of the frame (10). A groove (18) horizontally extends along the center line of side wall (12) of the frame (10) for receiving both the hook sections (58) which are respectively inwardly formed at the outermost edges of the side shielding walls (56) of the top and the bottom covers (50, 70). Between the top and the bottom covers (50, 70), an internal PC board (80) is seated on the frame whereby two connectors (90, 100) are respectively soldered on two opposite end regions of the PC board (80) and respectively retained at two opposite ends of the main frame (10) and therefore, the PC board (80) and the two associated connectors (90, 100) are appropriately held in position in the card assembly (1) for mating with the corresponding electrical devices.

US Patent:

52560856, Oct 26, 1993

Filed:

Nov 5, 1992

Appl. No.:

7/972159

Inventors:

Frank Ma - Diamond Bar CA
Yuan-Chieh Lin - Lake Forest CA

Assignee:

Foxconn International, Inc. - Sunnyvale CA

International Classification:

H01R 13648

US Classification:

439607

Abstract:

A receptacle connector (10) includes an insulative housing (12) having a front mating portion (14) projecting from a front face (16) of a flange section (18) and having a mating face (20) in the front. A pair of rows of passageways (70) extend longitudinally within the connector (10) to receive a plurality of corresponding contacts (52, 60) therein, respectively. A central cavity (50) is positioned along the lateral center line and extends inwardly from the mating face (20) for receiving a blade of a complementary plug connector therein. A conductive shield (80) has a shroud adapted to surround the front mating portion (14) wherein the front portion of the shield (80) extends vertically an appropriate distance toward the cavity (50). The edge of the front portion of the shield (80) is serrated for designedly stimulating point effect of an electrical discharge and effectively preventing any high voltage electrostatic charge from invading the internality of the connector (10) and damaging the internal circuit connected to the connector (10).

US Patent:

D3799689, Jun 17, 1997

Filed:

Sep 1, 1995

Appl. No.:

D/043401

Inventors:

Frank C. Ma - Diamond Bar CA

Assignee:

Hon Hai Precision Ind. Co., Ltd.

International Classification:

1303

US Classification:

D13147

US Patent:

D3773361, Jan 14, 1997

Filed:

Dec 8, 1995

Appl. No.:

D/047606

Inventors:

Frank C. Ma - Diamond Bar CA

Assignee:

Hon Hai Precision Ind. Co., Ltd.

US Classification:

D13147

US Patent:

54900433, Feb 6, 1996

Filed:

Apr 15, 1994

Appl. No.:

8/228141

Inventors:

Vincent Chen - Walnut CA
Frank C. Ma - Diamond Bar CA

Assignee:

Hon Hai Precision Ind. Co., Ltd.

International Classification:

H05K 900

US Classification:

361818

Abstract:

An I/O card (1) includes a rectangular frame (10) sandwiched between a top cover (11) and a bottom cover (13). Connector means (16, 18) are positioned at the ends of the I/O card (1) to form an in-and-out interface, and is mounted on a PC board (28) in the I/O card (1). A pair of top and bottom grounding clips (40, 30) are respectively attached on two opposite sides of the frame (10) and electrically and mechanically engage the top surface (29) and the bottom surface (27) of the inner PC board (28), respectively, wherein both grounding clips (30, 40) can be pre-assembled with the frame (10) and the bottom cover (13) as a semi-finished product which is delivered to an I/O card manufacturer who assembles the internal PC board (28) and the associated interface connectors (16, 18) to such pre-assembly without any interference from either of the grounding clips (30, 40) and successively places a top cover (11) thereon to complete the final product. In this situation, the top grounding clip (40) can be deformably depressed downward by the top cover (11) to electrically and mechanically contact the top surface (29) of the internal PC board (28) for grounding.