Frank A Parrish

US Patent:

6515499, Feb 4, 2003

Filed:

Sep 28, 2000

Appl. No.:

09/676041

Inventors:

Frank Parrish - Simi Valley CA
Arash Behziz - El Dorado Hills CA
Arthur E. LeColst - Moorpark CA
Derek Castellano - Simi Valley CA
Donald Eric Thompson - Oak Park CA
Jonathan M. Becker - Thousand Oaks CA

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

G01R 3102

US Classification:

324761, 3241581

Abstract:

A tester interface assembly is disclosed for coupling a plurality of tester electronic channels to a device-interface-board. The tester interface assembly includes at least one harness assembly having a plurality of coaxial cables, each cable including a body having a center conductor and a shield. The shield is formed coaxially around the center conductor and separated therefrom by a layer of dielectric. Each cable further includes a distal tip formed substantially similar to the body and including respective formed conductive pads disposed on the distal extremities of the center conductor and the shield. The harness employs a housing formed with an internal cavity for receiving and securing the cable distal ends in close-spaced relationship such that the distal tips form an interface engagement plane. A compliant interconnect is interposed between the harness assembly and the device-interface-board, and includes a plurality of conductors formed to engage the cable distal ends along the engagement plane.

US Patent:

6686732, Feb 3, 2004

Filed:

Dec 20, 2001

Appl. No.:

10/026861

Inventors:

Frank Parrish - Simi Valley CA

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

G01R 3102

US Classification:

3241581, 324755, 324761

Abstract:

An interface module for connecting a plurality of signal paths from a first electronic assembly to a second electronic assembly is disclosed. The interface module includes a plurality of coaxial cables having distal ends adapted for coupling to the first electronic assembly and proximal ends, each cable having a shield conductor and a center conductor. A stiffener formed with a plurality of throughbores receives the proximal ends of the plurality of signal cables, the stiffener having a flat termination side at one end of the plurality of throughbores. The module further includes a signal transition assembly having a flat substrate bonded to the stiffener termination side. The substrate includes respective opposite sides and is formed with spaced-apart signal paths and ground paths extending from one side to the other side. Each center conductor and shield conductor are electrically coupled to the signal paths and ground paths and mounted to the signal transition assembly to minimize relative axial displacement.

US Patent:

6916990, Jul 12, 2005

Filed:

Sep 30, 2002

Appl. No.:

10/261738

Inventors:

Arash Behziz - Agoura CA, US
Frank Parrish - Simi Valley CA, US
Donald Thompson - Thousand Oaks CA, US
Arthur LeColst - Moorpark CA, US
Keith Breinlinger - Hampstead NH, US
Brian Brecht - Newbury Park CA, US
Gerald H. Johnson - Andover MN, US

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

H01B007/08

US Classification:

174117FF

Abstract:

In one embodiment a high power interface apparatus is provided having a multilayer laminated cable including force conductor planes having flush and recessed portions and return conductor planes having flush and recessed portions. The flush portions of the conductor planes extend to a contact end of the laminated cable and the recessed portions are removed from the contact end. The flush portions are aligned along axes at the contact end. The flush portions of the return conductor planes are aligned at the contact end along axes aligned within recessed portions of the force conductor planes. A dielectric material separates the force and return conductor planes. Surface contact pads may be provided on the contact end including force contact pads, each contacting and extending along aligned flush portions of the force conductor planes, and including return conductor pads, each contacting and extending along aligned flush portions of the return conductor planes. The contact pads may be formed by plating the end, and then scoring. The multilayer laminate cable can be formed with a rigid portion near the contact end and a flexible portion between the cable ends.

US Patent:

6939175, Sep 6, 2005

Filed:

Dec 20, 2002

Appl. No.:

10/324607

Inventors:

Frank Parrish - Simi Valley CA, US
Arash Behziz - El Dorado Hills CA, US
Derek Castellano - Simi Valley CA, US
Arthur E. LeColst - Moorpark CA, US
Donald Eric Thompson - Oak Park CA, US
Jonathan M. Becker - Thousand Oaks CA, US

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

H01R009/05

US Classification:

439620, 439 63

Abstract:

A coaxial cable for transmitting high frequency signals includes includes a body having a center conductor and a shield formed coaxially around the center conductor and separated from the center conductor by a layer of dielectric having an annular layer of electro-static-discharge polymer. The cable also includes conductive pads to engage contacts on a mating connector. At least one of the conductive pads is attached to the center conductor and at least another one of the conductive pads is attached to the shield.

US Patent:

7180321, Feb 20, 2007

Filed:

Sep 27, 2005

Appl. No.:

11/235951

Inventors:

Arash Behziz - Thousand Oaks CA, US
Keith Breinlinger - Pleasanton CA, US
David Evans - Thousand Oaks CA, US
Frank Parrish - Simi Valley CA, US

Assignee:

Teradyne, Inc. - Boston MA

International Classification:

G01R 31/26

US Classification:

324765

Abstract:

In one embodiment, a tester interface module for connecting a plurality of signal paths from at least one electronic assembly to at least one other electronic assembly is provided. The interface module includes a capture board having center conductor vias with center conductor holes extending through the capture board. Axial cables secured to the capture board have center conductors extending at least part way through a corresponding center conductor hole of the center conductor via. An interface component is adjacent to the capture board, the conductor paths being conductively bonded to the conductor vias of the capture board so as to electrically connect center conductors to corresponding conductor paths. The conductor paths of the interface component are arranged to allow connection with an electronic assembly.

US Patent:

7504822, Mar 17, 2009

Filed:

Oct 28, 2005

Appl. No.:

11/262001

Inventors:

Frank B. Parrish - Simi Valley CA, US
Arash Behziz - Thousand Oaks CA, US

Assignee:

Teradyne, Inc. - North Reading MA

International Classification:

G01R 31/02

US Classification:

3241581, 324754

Abstract:

A device for interfacing a test head and a prober is disclosed using wires or cables to provide the connection from a probe card interface boards to the probe card. The use of wires or cables, in place of the traditional pogo pin arrangement allows for more reliable and efficient testing, as well as additional high performance tests to be run. Optionally, a probe interface contains a stiffening member with multiple sidewalks and individual, configuration-specific probe card interface strips are connected to a probe card through zero insertion force clamps. The probe card interface attaches to the test head using standard probe interface board (“PIB”) docking mechanics. The assembly is then connected to a probe to carry out the testing procedures.

US Patent:

7541819, Jun 2, 2009

Filed:

Oct 28, 2005

Appl. No.:

11/261962

Inventors:

Frank B. Parrish - Simi Valley CA, US
Brian Brecht - Newbury Park CA, US
Derek Castellano - Simi Valley CA, US

Assignee:

Teradyne, Inc. - North Reading MA

International Classification:

G01R 31/02

US Classification:

324754

Abstract:

The traditional device interface board is replaced by a number of smaller strips containing one or more electrical components for interfacing the device under test and the test head. The device interface modules may mount to a stiffening member having a back bone and multiple ribs running through the stiffening member. The device interface strips can create a lattice-like structure for the interface circuitry. Individual circuits may be disposed on the interface strips to perform functionality relating to the device under test and/or the test head.

US Patent:

7701232, Apr 20, 2010

Filed:

Jan 23, 2007

Appl. No.:

11/656825

Inventors:

Frank Parrish - Simi Valley CA, US

Assignee:

Teradyne, Inc. - North Reading MA

International Classification:

G01R 31/02

US Classification:

324754

Abstract:

A semiconductor wafer prober is configured to rotate a semiconductor wafer into relative alignment with a wafer-interface probe adapted to simultaneously probe a number of integrated circuits within a sector of the semiconductor wafer. The wafer can include integrated circuits having different orientations, such that all of the integrated circuits within a given sector being tested have the same orientation. For example, a semiconductor wafer can include two semicircular sectors, with the integrated circuits on either sector having a common orientation rotated 180 degrees from a common orientation of the integrated circuits of the other sector. A wafer-interface probe, or probe card, adapted to test the entire semicircular sector during a single touch down is able to test the entire wafer with one rotational translation between testing.