Frank R Sanders

US Patent:

7201583, Apr 10, 2007

Filed:

Dec 31, 2003

Appl. No.:

10/749818

Inventors:

David W. Boggs - Hillsboro OR, US
John H. Dungan - Hillsboro OR, US
Frank A. Sanders - Beaverton OR, US
Daryl A. Sato - Portland OR, US
Dan Willis - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 12/00
H05K 1/00

US Classification:

439 66

Abstract:

A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

US Patent:

7241680, Jul 10, 2007

Filed:

Apr 30, 2004

Appl. No.:

10/835675

Inventors:

David W. Boggs - Hillsboro OR, US
John H. Dungan - Hillsboro OR, US
Frank A. Sanders - Beaverton OR, US
Daryl A. Sato - Portland OR, US
Dan Willis - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/44
H01L 21/48
H01L 21/50

US Classification:

438613, 438106, 438117, 438123, 438E2306, 257737

Abstract:

Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

US Patent:

7325303, Feb 5, 2008

Filed:

Dec 8, 2006

Appl. No.:

11/635965

Inventors:

David W. Boggs - Hillsboro OR, US
John H. Dungan - Hillsboro OR, US
Frank A. Sanders - Beaverton OR, US
Daryl A. Sato - Portland OR, US
Dan Willis - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 43/16

US Classification:

29874, 29878, 29879, 29884, 439591

Abstract:

A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plurality of pressure contacts on the other side of the interposer. Each of the pressure contacts having a directionally deformable contact surface to removably contact a plurality of second contacts of a second electronic device on the other side of the interposer. Also methods of forming the interposer.

US Patent:

7385288, Jun 10, 2008

Filed:

Jun 11, 2007

Appl. No.:

11/761315

Inventors:

David W. Boggs - Hillsboro OR, US
John H. Dungan - Hillsboro OR, US
Frank A. Sanders - Beaverton OR, US
Daryl A. Sato - Portland OR, US
Dan Willis - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H01L 23/14

US Classification:

257737, 257702, 257778, 257E23021

Abstract:

Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.