Frederick E Reed

US Patent:

8324511, Dec 4, 2012

Filed:

Apr 6, 2010

Appl. No.:

12/754837

Inventors:

Ronald Patrick Huemoeller - Gilbert AZ, US
Frederick Evans Reed - Raleigh NC, US
David Jon Hiner - Chandler AZ, US
Kiwook Lee - Seoul, KR

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H05K 1/11

US Classification:

174262, 174255

Abstract:

A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.