Frederick A Yeagle

age ~69

from Leesport, PA

Also known as:
  • Frederic Yeagle
  • Fred Yeagle
  • Fredrick Yeagle
  • Susan Yeagle

Frederick Yeagle Phones & Addresses

  • Leesport, PA
  • Reading, PA
  • Pottstown, PA

Us Patents

  • Automated Fluxless Soldering Using Inert Gas

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  • US Patent:
    61964468, Mar 6, 2001
  • Filed:
    Sep 13, 1999
  • Appl. No.:
    9/394978
  • Inventors:
    Lu Fang - Whitehall PA
    Brian Dale Potteiger - Reading PA
    Shaun P. Scrak - Souderton PA
    Frederick Arthur Yeagle - Leesport PA
  • Assignee:
    Lucent Technologies Inc. - Murray Hill NJ
  • International Classification:
    B23K 100
    B23K 2014
    B23K 3102
    B23K 3538
  • US Classification:
    228219
  • Abstract:
    An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i. e. , the inert gases provide a "shield" or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.
  • Direct-Placement Fluxless Soldering Using Inert Gas Environment

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  • US Patent:
    6206276, Mar 27, 2001
  • Filed:
    Sep 13, 1999
  • Appl. No.:
    9/395085
  • Inventors:
    Lu Fang - Whitehall PA
    Brian Dale Potteiger - Reading PA
    Frederick W. Warning - Mertztown PA
    Frederick Arthur Yeagle - Leesport PA
  • Assignee:
    Lucent Technologies Inc. - Murray Hill NJ
  • International Classification:
    B23K20/14;31/02;35/38
  • US Classification:
    228219
  • Abstract:
    A method for providing fluxless soldering without oxide formation includes mounting a component on a pedestal of a base. A housing is also mounted on the base, the housing and the base together define a closed cavity containing the component. An inert gas is introduced into the cavity to create an inert gas-rich environment. Thereafter, the cavity is heated sufficiently to reflow solder provided between the component and the housing, to join the component to the housing without the formation of additional oxides on the solder joint.
  • Fixture With At Least One Trough And Method Of Using The Fixture In A Plasma Or Ion Beam

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  • US Patent:
    62105469, Apr 3, 2001
  • Filed:
    Oct 29, 1998
  • Appl. No.:
    9/182722
  • Inventors:
    David G. Coult - Oley PA
    Gustav E. Derkits - New Providence NJ
    Walter J. Shakespeare - Macungie PA
    Duane D. Wendling - Kutztown PA
    Frederick A. Yeagle - Leesport PA
  • Assignee:
    Lucent Technologies Inc. - Murray Hill NJ
  • International Classification:
    C23C 1446
    C23C 1450
    C23F 100
  • US Classification:
    20419232
  • Abstract:
    Optical components, such as optical semi-isolators, are placed in a fixture that exposes at least a portion of the mounting surface of each optical component when a plasma or ion beam is directed at one side of the fixture, while shielding sensitive surfaces of the optical components (e. g. , an optical element mounted within the frame of the optical component) from direct exposure to the plasma or ion beam. Exposure to the plasma or ion beam removes contaminants (e. g. , metal oxide) that form on the mounting surface during the fabrication of the optical components when the optical element is mounted within its frame using glass solder in a heated oxygenated environment (e. g. , air). By removing enough of the contaminants, the plasma or ion beam cleaning step produces optical components that can be reliably mounted onto substrates, such as the ceramic substrates used in encapsulated laser packages, using flux-less auto-bonding techniques.
  • Apparatus And Method For Glass Ball Lens Polishing

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  • US Patent:
    61358673, Oct 24, 2000
  • Filed:
    Jul 7, 1999
  • Appl. No.:
    9/349006
  • Inventors:
    Frederick A. Yeagle - Leesport PA
    Brian D. Potteiger - Reading PA
    Faisal A. Nabulsi - Allentown PA
  • Assignee:
    Lucent Technologies Inc. - Murray Hill NJ
  • International Classification:
    B24B 4106
  • US Classification:
    451364
  • Abstract:
    An apparatus and method for polishing a rotationally symmetric object such as a glass ball lens. The apparatus includes first and second plates for securing a plurality of glass ball lenses therebetween. The plates are secured to one another and the entire apparatus is pressed against a polishing pad in order to flatten a portion of the surface of the lenses. The apparatus also serves to maintain the orientation of the rotationally symmetric objects, so that they may be easily operated upon by future processing steps.
  • System For Providing Back-Lighting Of Components During Fluxless Soldering

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  • US Patent:
    61931357, Feb 27, 2001
  • Filed:
    Sep 13, 1999
  • Appl. No.:
    9/394983
  • Inventors:
    Lu Fang - Whitehall PA
    Brian Dale Pottelger - Reading PA
    Dominic Paul Rinaudo - Blandon PA
    Frederick Arthur Yeagle - Leesport PA
  • Assignee:
    Lucent Technologies Inc. - Murray Hill NJ
  • International Classification:
    B23K 100
    B23K 2014
    B23K 3102
    B23K 3538
  • US Classification:
    228105
  • Abstract:
    An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i. e. , the inert gases provide a "shield" or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.

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