Gail Young Shelton

US Patent:

56049773, Feb 25, 1997

Filed:

Jun 7, 1995

Appl. No.:

8/478570

Inventors:

James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01R 4300

US Classification:

29825

Abstract:

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

US Patent:

54573181, Oct 10, 1995

Filed:

Apr 29, 1994

Appl. No.:

8/235413

Inventors:

James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01J 506

US Classification:

250332

Abstract:

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).