Lam Research
Senior Vice President Strategic Development, Corporate Marketing and Communications
Bultman Consulting Jan 2008 - May 2010
Principal
Kla-Tencor 2001 - 2007
Senior V.p Business Development, Chief Marketing Officer
Blue29 2004 - 2006
Member of Bod
Kla-Tencor 2000 - 2001
V.p and G.m Integraged Products Divison
Education:
Kansas State University
Bachelors, Bachelor of Science, Nuclear Engineering
Skills:
Strategy Semiconductors Start Ups Product Development Business Strategy Cross Functional Team Leadership Mergers and Acquisitions Business Development Product Management Manufacturing Marketing Strategy Go To Market Strategy Semiconductor Industry Engineering Management Product Marketing Program Management Strategic Alliances Mergers Metrology Venture Capital Leadership Strategic Partnerships Management P&L Management R&D Ic Product Lifecycle Management Thin Films Competitive Analysis Market Analysis New Business Development Research and Development Marketing Product Launch Operations Management Strategy Development Executive Management International Business Integrated Circuits Project Planning Patents Forecasting
Us Patents
Methods And Systems For Determining A Presence Of Macro Defects And Overlay Of A Specimen
Dan Wack - Los Altos CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Gary Bultman - Los Altos CA Mehrdad Nikoonahad - Menlo Park CA John Fielden - Los Altos CA
Assignee:
KLA-Tencor Technologies - Milpitas CA
International Classification:
H01L 2166
US Classification:
438 14, 356 72
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro defects and overlay of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining At Least Four Properties Of A Specimen
Mehrdad Nikoonahad - Menlo Park CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Gary Bultman - Los Altos CA Dan Wack - Los Altos CA John Fielden - Los Altos CA
Assignee:
KLA-Tencor Technologies Corp. - Milpitas CA
International Classification:
G01B 1500
US Classification:
702155, 702 35
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, at least four properties of a specimen such as critical dimension, overlay, a presence of macro defects, and thin film characteristics. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining A Critical Dimension An A Presence Of Defects On A Specimen
Dan Wack - Los Altos CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Gary Bultman - Los Altos CA Mehrdad Nikoonahad - Menlo Park CA John Fielden - Los Altos CA
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining At Least One Characteristic Of Defects On At Least Two Sides Of A Specimen
Dan Wack - Los Altos CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Rodney C. Smedt - Los Gatos CA Gary Bultman - Los Altos CA Mehrdad Nikoonahad - Menlo Park CA John Fielden - Los Altos CA
Assignee:
KLA-Tencor Technologies Corp. - Miliptas CA
International Classification:
G01N 2100
US Classification:
3562372, 3562374
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, at least one characteristic of defects on at least two sides of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining A Characteristic Of A Specimen Prior To, During, Or Subsequent To Ion Implantation
Mehrdad Nikoonahad - Menlo Park CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Gary Bultman - Los Altos CA Dan Wack - Los Altos CA John Fielden - Los Altos CA
Assignee:
KLA-Tencor, Inc. - San Jose CA
International Classification:
H01L 2166
US Classification:
438 14, 438 15
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a specimen prior to, during, or subsequent to ion implantation. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining A Presence Of Macro Defects And Overlay Of A Specimen
Dan Wack - Los Altos CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Gary Bultman - Los Altos CA Mehrdad Nikoonahad - Menlo Park CA John Fielden - Los Altos CA
Assignee:
KLA-Tencor Technologies Corp. - Milpitas CA
International Classification:
H01L 2166
US Classification:
438 14, 438 16, 356 72
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro defects and overlay of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining A Presence Of Macro And Micro Defects On A Specimen
Gary Bultman - Los Altos CA Ady Levy - Sunnyvale CA Kyle A. Brown - Irvine CA Mehrdad Nikoonahad - Menlo Park CA Dan Wack - Los Altos CA John Fielden - Los Altos CA
Assignee:
K.L.A.-Tencor Technologies - Milpitas CA
International Classification:
G01B 1500
US Classification:
702155, 702 35
Abstract:
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Methods And Systems For Determining An Implant Characteristic And A Presence Of Defects On A Specimen
Mehrdad Nikoonahad - Menlo Park CA, US Ady Levy - Sunnyvale CA, US Kyle A. Brown - Irvine CA, US Gary Bultman - Los Altos CA, US Dan Wack - Los Altos CA, US John Fielden - Los Altos CA, US
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an implant characteristic and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
Gary Bultman 1980 graduate of Kansas State University - Engineering in Manhattan, KS is on Classmates.com. See pictures, plan your class reunion and get caught up with Gary and ...
Gary Bultman 1960 graduate of Wilson High School in St. paul, MN is on Classmates.com. See pictures, plan your class reunion and get caught up with Gary and other high school alumni
Gary Bultman's Public Profile on Plaxo. Plaxo helps members like Gary Bultman keep in touch with the people who really matter, helping them to connect, keep each other's contact ...