Gary A Clayton

US Patent:

6564455, May 20, 2003

Filed:

Feb 23, 2001

Appl. No.:

09/792855

Inventors:

Gary A. Clayton - Boise ID
Douglas G. Hastings - Meridian ID

Assignee:

R-Tec Corporation - Meridian ID

International Classification:

H01R 4300

US Classification:

29876, 29883, 29874, 324755

Abstract:

A method of making a socket test probe which results in a probe head which has flat plates which serve as electrodes encased in resin. The electrodes are conductive plates with one or more edges of the conductive plates exposed for connection to the electrodes of a socket. The entire probe head starts as a solid block of conductive material which is drilled, machined, filled with resin and machined again to form a socket testing probe utilizing the edges of conductive plates as electrodes.

US Patent:

6527563, Mar 4, 2003

Filed:

Jul 23, 2001

Appl. No.:

09/912111

Inventors:

Gary A. Clayton - Boise ID 83713

International Classification:

H01R 1200

US Classification:

439 66, 439 74

Abstract:

A grid interposer for testing electrical circuits and a method of making a grid interposer. The grid interposer includes upper and lower conductive surfaces sandwiched on either side of an insulating later, connected to each other by a plurality of vias filled with conductive material. The conductive surfaces are flat topped, and incised with a grid of flat topped peaks which are small enough to cut through oxidation of electrical contacts, and ensure good electrical contact with a variety of electrode shapes.

US Patent:

20020115315, Aug 22, 2002

Filed:

Jan 1, 2002

Appl. No.:

10/043459

Inventors:

Gary Clayton - Meridian ID, US

International Classification:

H05K001/00

US Classification:

439/070000

Abstract:

A removable chip socket for mounting on printed circuit boards and for holding an electrical chip into an electrical engagement with the circuitry of the printed circuit board. When used in a bum-in board, individual chip sockets can be replaced as necessary. The removable chip socket also includes replaceable connection posts, which can be changed to repair bad electrical connections.

US Patent:

20030094666, May 22, 2003

Filed:

Oct 1, 2002

Appl. No.:

10/263599

Inventors:

Gary Clayton - Boise ID, US
Douglas Hastings - Meridian ID, US

Assignee:

R-TEC Corporation - Meridian ID

International Classification:

H01L031/00

US Classification:

257/459000

Abstract:

An improved interposer and method for making an interposer, for use in forming an electrical connection between electrical components. The interposer includes a bi-lobate contact pad made of an elastomeric material embedded with conductive metallic granules. This application claims the priority date of the provisional application entitled Interposer filed by Gary Clayton and Douglas G. Hastings on Nov. , with serial No.

US Patent:

20050017369, Jan 27, 2005

Filed:

Nov 15, 2002

Appl. No.:

10/495959

Inventors:

Gary Clayton - Boise ID, US
Douglas Hastings - Meridian ID, US

International Classification:

H01L023/48

US Classification:

257774000

Abstract:

An improved interposer for use in forming an electrical connection between electrical components. The interposer includes a bi-lobate contact pad made of an elastomeric material embedded with conductive metallic granules.

US Patent:

20070204916, Sep 6, 2007

Filed:

Mar 1, 2006

Appl. No.:

11/365413

Inventors:

Gary Clayton - Vail AZ, US
Victor Olivas - Tucson AZ, US

International Classification:

F16K 15/00

US Classification:

137512000

Abstract:

A backflow prevention device includes a main body holding a removable cartridge. The removable cartridge houses two independently acting check valves and, optionally, a relief valve. A first portion of the cartridge may be retracted into a second portion of the cartridge, thereby reducing the overall length of the cartridge and facilitating the removal of the cartridge from the main body without the need to remove the backflow prevention device from a water supply system. The relief valve is contained in a removable cartridge. Each check valve may have a self cleaning plunger bore comprising at least one spiral groove.

US Patent:

20070204917, Sep 6, 2007

Filed:

Apr 25, 2006

Appl. No.:

11/411735

Inventors:

Gary Clayton - Vail AZ, US
Victor Olivas - Tucson AZ, US

International Classification:

F16K 15/00

US Classification:

137512000

Abstract:

A backflow prevention device includes a main body holding a removable cartridge. The removable cartridge houses two independently acting check valves and, optionally, a relief valve. A first portion of the cartridge may be retracted into a second portion of the cartridge, thereby reducing the overall length of the cartridge and facilitating the removal of the cartridge from the main body without the need to remove the backflow prevention device from a water supply system. The relief valve is contained in a removable cartridge. Each check valve may have a self cleaning plunger bore comprising at least one spiral groove.

US Patent:

20130299232, Nov 14, 2013

Filed:

May 11, 2012

Appl. No.:

13/469798

Inventors:

Bruce C. Fitz-Patrick - Tucson AZ, US
Gary A. Clayton - Vail AZ, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 5/02
B22D 25/02

US Classification:

174547, 164 98, 164 761

Abstract:

Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid. As an example, the at least one fluid transport structure could consist essentially of nickel, and the electronics enclosure could consist essentially of aluminum.