Gary M Clayton

US Patent:

6564455, May 20, 2003

Filed:

Feb 23, 2001

Appl. No.:

09/792855

Inventors:

Gary A. Clayton - Boise ID
Douglas G. Hastings - Meridian ID

Assignee:

R-Tec Corporation - Meridian ID

International Classification:

H01R 4300

US Classification:

29876, 29883, 29874, 324755

Abstract:

A method of making a socket test probe which results in a probe head which has flat plates which serve as electrodes encased in resin. The electrodes are conductive plates with one or more edges of the conductive plates exposed for connection to the electrodes of a socket. The entire probe head starts as a solid block of conductive material which is drilled, machined, filled with resin and machined again to form a socket testing probe utilizing the edges of conductive plates as electrodes.

US Patent:

6527563, Mar 4, 2003

Filed:

Jul 23, 2001

Appl. No.:

09/912111

Inventors:

Gary A. Clayton - Boise ID 83713

International Classification:

H01R 1200

US Classification:

439 66, 439 74

Abstract:

A grid interposer for testing electrical circuits and a method of making a grid interposer. The grid interposer includes upper and lower conductive surfaces sandwiched on either side of an insulating later, connected to each other by a plurality of vias filled with conductive material. The conductive surfaces are flat topped, and incised with a grid of flat topped peaks which are small enough to cut through oxidation of electrical contacts, and ensure good electrical contact with a variety of electrode shapes.

US Patent:

D649983, Dec 6, 2011

Filed:

Nov 14, 2008

Appl. No.:

29/327898

Inventors:

Eric Hancock - Elk Grove Village IL, US
Gary Clayton - Elk Grove Village IL, US

Assignee:

Merkle-Korff Industries, Inc. - Elk Grove Village IL

International Classification:

1507

US Classification:

D15 89

US Patent:

20020115315, Aug 22, 2002

Filed:

Jan 1, 2002

Appl. No.:

10/043459

Inventors:

Gary Clayton - Meridian ID, US

International Classification:

H05K001/00

US Classification:

439/070000

Abstract:

A removable chip socket for mounting on printed circuit boards and for holding an electrical chip into an electrical engagement with the circuitry of the printed circuit board. When used in a bum-in board, individual chip sockets can be replaced as necessary. The removable chip socket also includes replaceable connection posts, which can be changed to repair bad electrical connections.

US Patent:

20030094666, May 22, 2003

Filed:

Oct 1, 2002

Appl. No.:

10/263599

Inventors:

Gary Clayton - Boise ID, US
Douglas Hastings - Meridian ID, US

Assignee:

R-TEC Corporation - Meridian ID

International Classification:

H01L031/00

US Classification:

257/459000

Abstract:

An improved interposer and method for making an interposer, for use in forming an electrical connection between electrical components. The interposer includes a bi-lobate contact pad made of an elastomeric material embedded with conductive metallic granules. This application claims the priority date of the provisional application entitled Interposer filed by Gary Clayton and Douglas G. Hastings on Nov. , with serial No.

US Patent:

20050017369, Jan 27, 2005

Filed:

Nov 15, 2002

Appl. No.:

10/495959

Inventors:

Gary Clayton - Boise ID, US
Douglas Hastings - Meridian ID, US

International Classification:

H01L023/48

US Classification:

257774000

Abstract:

An improved interposer for use in forming an electrical connection between electrical components. The interposer includes a bi-lobate contact pad made of an elastomeric material embedded with conductive metallic granules.

US Patent:

60641959, May 16, 2000

Filed:

May 11, 1998

Appl. No.:

9/076314

Inventors:

Gary A. Clayton - Boise ID
Douglas G. Hastings - Meridian ID

Assignee:

R-Tec Corporation - Meridian ID

International Classification:

G01R 3102
H01R 3902

US Classification:

3241581

Abstract:

An alignment system for positioning a socket test probe in a socket of a printed circuit board to be tested. The socket test probe is self-aligning in the socket by use of a free-floating ball joint enclosed in a ball joint housing. The socket test probe is connected through a probe body to the ball joint, and is held in an immobilized position until it is ready to enter a socket. When entering a socket, the probe body is free floating about the ball joint, and the socket test probe aligns itself for entry into the socket by friction between the socket and the socket test probe. A clamp on the probe body immobilizes or frees the probe body with its attached socket test probe. The clamp is activated by air pressure.

US Patent:

61949043, Feb 27, 2001

Filed:

May 19, 1998

Appl. No.:

9/082291

Inventors:

Gary A. Clayton - Boise ID
Douglas G. Hastings - Meridian ID

Assignee:

R-Tec Corporation - Meridian ID

International Classification:

G01R 3100

US Classification:

324754

Abstract:

A socket test probe and a method of making the probe which results in a probe head which has flat plates which serve as electrodes encased in resin. The electrodes are conductive plates with one or more edges of the conductive plates exposed for connection to the electrodes of a socket. The entire probe head starts as a solid block of conductive material which is drilled, machined, filled with resin and machined again to form a socket testing probe utilizing the edges of conductive plates as electrodes.