Gary R Lewis

US Patent:

6418801, Jul 16, 2002

Filed:

Jul 18, 2001

Appl. No.:

09/908526

Inventors:

Gary W. Lewis - Foothill Ranch CA

Assignee:

Horiba Instruments, Inc. - Irvine CA

International Classification:

G01N 100

US Classification:

7386473

Abstract:

A sample bag for collecting a mixture of gasses for analysis is made of a modified polymer consisting essentially of tetrafluoroethylene (TFE) and at most about 2. 0 percent perfluoropropylvinylether (PPVE).

US Patent:

6546812, Apr 15, 2003

Filed:

May 11, 2001

Appl. No.:

09/854340

Inventors:

Gary W. Lewis - Foothill Ranch CA 92610

International Classification:

G01F 144

US Classification:

7386163, 738632

Abstract:

An apparatus for sampling the emission content of an exhaust gas from an exhaust source has an exhaust inlet adapted for connecting the exhaust source with a venturi metering device for measuring the flow rate of the exhaust gas. The venturi metering device includes a housing having an entrance section, a throat section, and an exit section, the throat section having a smaller diameter than the entrance and exit sections. The housing includes first and second pressure transducers that produce an electrical output that characterizes the pressure that the pressure sensing means senses, the electrical outlet enabling a computer of the venturi metering device to accurately measure the pulsating flow of the exhaust gas in both directions.

US Patent:

6578440, Jun 17, 2003

Filed:

Jun 20, 2002

Appl. No.:

10/175706

Inventors:

Gary W. Lewis - Foothill Ranch CA

Assignee:

Horiba Instruments, Inc. - Irvine CA

International Classification:

G01N 114

US Classification:

7386462

Abstract:

A sample bag for collecting a mixture of gasses for analysis is made of a modified polymer consisting essentially of tetrafluoroethylene (TFE) and at most about 2. 0 percent perfluoropropylvinylether (PPVE).

US Patent:

62794086, Aug 28, 2001

Filed:

Sep 28, 2000

Appl. No.:

9/672242

Inventors:

Gary W. Lewis - Foothill Ranch CA

Assignee:

Horiba Instruments, Inc. - Irving CA

International Classification:

G01N 114

US Classification:

7386462

Abstract:

A sample bag for collecting a mixture of gasses for analysis is made of a modified polymer consisting essentially of tetrafluoroethylene (TFE) and at most about 2. 0 percent perfluoropropylvinylether (PPVE).

US Patent:

57563802, May 26, 1998

Filed:

Nov 2, 1995

Appl. No.:

8/556782

Inventors:

Howard M. Berg - Scottsdale AZ
Sankaranarayanan Ganesan - Chandler AZ
Gary L. Lewis - Peoria AZ
George W. Hawkins - Gilbert AZ
James W. Sloan - Austin TX
Scott C. Bolton - Austin TX

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

438126

Abstract:

A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

US Patent:

43994539, Aug 16, 1983

Filed:

Mar 23, 1981

Appl. No.:

6/246506

Inventors:

Howard M. Berg - Scottsdale AZ
Gary L. Lewis - Peoria AZ
Curtis W. Mitchell - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302
H01L 2714
H01L 3300

US Classification:

357 81

Abstract:

A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

US Patent:

51740630, Dec 29, 1992

Filed:

Aug 27, 1991

Appl. No.:

7/750271

Inventors:

Gary B. Lewis - San Diego CA
Charles R. Temple - Chula Vista CA

International Classification:

E05B 6510

US Classification:

49141

Abstract:

A releasing system for retaining a cover over an opening in a structure. A penetrating member connected to the protective cover is tapered at one end and has a notch just beyond the taper. A housing contains a spring latch made of bent steel strip. One end of the spring latch is firmly attached to the housing and the free end of the spring latch is located behind and partially covers an opening in the housing. The spring latch is positioned so that the tapered portion of said penetrating member will push the free end of the spring latch aside when the penetrating member is entering the housing, and the free end will fit into said notch when the penetrating member is essentially fully inserted into said housing. One end of a release cable is attached to the spring latch near its free end and when pulled with sufficient force will cause the free end of the spring latch to be pulled out of the notch releasing the penetrating member.

US Patent:

61229806, Sep 26, 2000

Filed:

Jun 26, 1998

Appl. No.:

9/105350

Inventors:

Gary W. Lewis - Foothill Ranch CA
William M. Silvis - Ann Arbor MI

Assignee:

Horiba Instruments, Inc. - Irvine CA

International Classification:

G01N 120
G01N 138

US Classification:

7386343

Abstract:

A mixing system includes a dilution inlet, an elbow duct, and a gaseous inlet in flow communication with the elbow duct along the elbow duct outer turning radius. The elbow duct has a first end in flow communication with the dilution inlet, and a second end outlet for connecting to external equipment, such as a sampling system.

Address:

16815 S 25 Pl, Phoenix, AZ 85048

Phone:

4806884247

VIN:

1HGCP3F8XCA042859

Make:

HONDA

Model:

ACCORD

Year:

2012