Institute of Chartered Accountants In Ireland 2005 - 2011
Associates
University College Dublin 2004 - 2005
Masters, Accounting
Portobello College 2001 - 2004
Bachelors, Bachelor of Business Administration
Microsoft Office Construction Green Building Contractors Negotiation Residential Homes Construction Management Entitlements Steel Strategic Planning Contract Negotiation Project Planning Renovation
A microprocessor controlled data recovery unit with an adjustable sampling and signal comparison level. The data recovery unit includes a data channel and a monitor channel. The monitor channel samples an incoming data stream in a varying manner. The results of the sampling in the monitor channel are used to adjust the sampling and comparing of the signal in the data channel. The data recovery unit includes a PLL based clock recovery unit in one embodiment, and in another embodiment the clock signal is derived by the microprocessor.
Gary McCormack - Tigard OR, US Ian A. Kyles - West Linn OR, US Angus J. McCamant - Aloha OR, US Norbert J. Seitz - Beaverton OR, US Richard R. Suter - Beaverton OR, US
Assignee:
Vitesse Semiconductor Corporation - Camarillo CA
International Classification:
H04Q001/00
US Classification:
340 228, 327307, 361277
Abstract:
A crosspoint switch including a switch matrix modules and programming features. A switch matrix modules include input lines tied to inputs of the switch through precompensation networks. The programming features include user initialization states and reduced and grouping command configuration operations.
A microprocessor controlled data recovery unit with an adjustable sampling and signal comparison level. The data recovery unit includes a data channel and a monitor channel. The monitor channel samples an incoming data stream in a varying manner. The results of the sampling in the monitor channel are used to adjust the sampling and comparing of the signal in the data channel. The data recovery unit includes a PLL based clock recovery unit in one embodiment, and in another embodiment the clock signal is derived by the microprocessor.
Gary McCormack - Tigard OR, US Ian A. Kyles - West Linn OR, US Angus J. McCamant - Aloha OR, US Norbert J. Seitz - Beaverton OR, US Richard R. Suter - Beaverton OR, US
Assignee:
Vitesse Semiconductor Corporation - Camarillo CA
International Classification:
H04Q 1/00
US Classification:
340 228, 327307, 257701
Abstract:
A crosspoint switch including a switch matrix modules and programming features. A switch matrix modules include input lines tied to inputs of the switch through precompensation networks. The programming features include user initialization states and reduced and grouping command configuration operations.
Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.
Integrated Circuit With Electromagnetic Communication
Ian A. Kyles - West Linn OR, US Gary D. McCormack - Tigard OR, US
Assignee:
WAVECONNEX, INC. - Westlake Village CA
International Classification:
H04L 25/02
US Classification:
375259
Abstract:
A system for transmitting or receiving signals may include an integrated circuit (IC), a transducer operatively coupled to the IC for converting between electrical signals and electromagnetic signals; and insulating material that fixes the locations of the transducer and IC in spaced relationship relative to each other. The system may further include a lead frame providing external connections to conductors on the IC. An electromagnetic-energy directing assembly may be mounted relative to the transducer for directing electromagnetic energy in a region including the transducer and in a direction away from the IC. The directing assembly may include the lead frame, a printed circuit board ground plane, or external conductive elements spaced from the transducer. In a receiver, a signal-detector circuit may be responsive to a monitor signal representative of a received first radio-frequency electrical signal for generating a control signal that enables or disables an output from the receiver.
Gary D. McCormack - Tigard OR, US Ian A. Kyles - West Linn OR, US
Assignee:
WAVECONNEX, INC. - Westlake Village CA
International Classification:
G06K 19/073
US Classification:
235492
Abstract:
A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.
Gary D. McCormack - Tigard OR, US Ian A. Kyles - West Linn OR, US
Assignee:
WAVECONNEX, INC. - Westlake Village CA
International Classification:
H04B 5/00 G06F 13/28
US Classification:
710303, 455 411
Abstract:
A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.