An illuminated display device for a motor vehicle. The illuminated display device (10) comprises a lamp housing (12) for being secured to the license plate support structure of a vehicle in lieu of a license plate, the housing (12) having a rear wall (16) engaging the license plate support structure and defining a forwardly disposed opening (14). The housing (12) also includes a lower portion provided with license plate support brackets for engaging and supporting a license plate. A display panel (42) is mounted in the opening (14), at least a portion of which is translucent, and a lamp (34) is mounted within the lamp housing (12) for illuminating the display panel (42).
Semiconductor Packages And Associated Methods With Solder Mask Opening(S) For In-Package Ground And Conformal Coating Contact
Semiconductor devices with a conformal coating in contact with a ground plane at a bottom side of the semiconductor devices and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a first surface of a package substrate. The semiconductor device can also include a molded material covering at least a portion of the package substrate and the semiconductor die. The semiconductor device can also include a ground plane in the package substrate and exposed through an opening in a second surface of the package substrate opposite the first surface. The semiconductor device can also include a conformal coating coupled to the ground plane through the opening that can shield the semiconductor device from electromagnetic interference.
Semiconductor Packages And Associated Methods With Solder Mask Opening(S) For In-Package Ground And Conformal Coating Contact
Semiconductor devices with a conformal coating in contact with a ground plane at a bottom side of the semiconductor devices and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a first surface of a package substrate. The semiconductor device can also include a molded material covering at least a portion of the package substrate and the semiconductor die. The semiconductor device can also include a ground plane in the package substrate and exposed through an opening in a second surface of the package substrate opposite the first surface. The semiconductor device can also include a conformal coating coupled to the ground plane through the opening that can shield the semiconductor device from electromagnetic interference.
Isbn (Books And Publications)
Cassadaga: The South's Oldest Spiritualist Community
Providence Anchorage Anesthesia 3200 Providence Dr STE 207, Anchorage, AK 99508 9075610005 (phone), 9075639140 (fax)
Education:
Medical School University of Texas Medical Branch at Galveston Graduated: 1979
Languages:
English Spanish
Description:
Dr. Monroe graduated from the University of Texas Medical Branch at Galveston in 1979. He works in Anchorage, AK and specializes in Anesthesiology. Dr. Monroe is affiliated with Providence Alaska Medical Center.
Patrick Wilson, Charles Gruver, Peggy O'dell, Ann Adams, Josephine Dobbs, George King, William Yarbrough, Helen Troutt, Alyce Wilson, Janette Marshall, Fred Boswell
Gary Monroe (1981-1985), Morris Kent (1960-1964), Dion Jordan (1984-1988), Renee Singleton (1971-1975), Robert Cooper (1976-1979), Robert Pattavina (1956-1960)