Gary D Morrison

US Patent:

7790597, Sep 7, 2010

Filed:

Jun 6, 2008

Appl. No.:

12/134337

Inventors:

Satyendra S. Chauhan - Sugar Land TX, US
Rajiv C. Dunne - Murphy TX, US
Gary P. Morrison - Garland TX, US
Masood Murtuza - Sugar Land TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 23/48
H01L 21/44

US Classification:

438613, 257737, 257738, 257E2301, 257E23023, 257E21476, 438614, 438615, 438616

Abstract:

A method used during the formation of a semiconductor device assembly can include contacting an end of a conductive bump (which can be a pillar, ball, pad, post, stud, or lead as well as other types of bumps) with a conductive powder such as a solder powder to adhere the conductive powder to the end of the bump. The powder can be flowed, for example by heating, to distribute it across the end of the bump. The flowed powder can be placed in contact with a conductive pad of a receiving substrate and can then be reflowed to facilitate electrical connection between the bump and the conductive pad.