Gary R Waldsmith

US Patent:

51991594, Apr 6, 1993

Filed:

Nov 20, 1991

Appl. No.:

7/796115

Inventors:

Gary R. Waldsmith - Pilot Hill CA

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

H02K 1502
B23P 1904

US Classification:

29596

Abstract:

A method of separating structure comprising first and second components having different coefficients of thermal expansion and bonded together with a bonding material. Separation is achieved by immersing the structure in a cryogenic cooling substance to break the bonding material as a result of the different rates of expansion of the two components and then applying a force to separate the two components. Separation of a rotor and its windings is disclosed.

US Patent:

54488176, Sep 12, 1995

Filed:

Jun 27, 1994

Appl. No.:

8/272912

Inventors:

Gary R. Waldsmith - Pilot Hill CA

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

B23P 1900

US Classification:

294265

Abstract:

The use of a liquid nitrogen (LN. sub. 2) bath to produce thermal stress between an aluminum heat sink and a silicon circuit board by deep cooling, makes it possible to separate each from the other product undamaged. This allows repair or replacement of the silicon substrate in a very short time with very little turn around time.

US Patent:

52973271, Mar 29, 1994

Filed:

Jun 25, 1993

Appl. No.:

8/083754

Inventors:

Gary R. Waldsmith - Pilot Hill CA

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

B23P 1904

US Classification:

294033

Abstract:

A defective focusing coil, impregnated with and held in place with epoxy is removed from its inner lead liner and its outer brass housing by immersing the assembled parts in a bath of liquid nitrogen until the temperature of the assembly is reduced to the temperature of the liquid nitrogen, about -350. degree. F. The assembly is then removed from the bath and a series of sharp blows are then directed to the side of the brass housing to break the bond between the super cooled epoxy and the housing. Axial pressure is then applied to the coil, to remove the coil and liner. The coil is then cut longitudinally into two half cylinders, whereupon the coil is split from the liner, all without injury to either the liner or the housings.

US Patent:

50706039, Dec 10, 1991

Filed:

Jan 31, 1991

Appl. No.:

7/648071

Inventors:

Gary R. Waldsmith - Pilot Hill CA

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

H05K 300

US Classification:

29829

Abstract:

A method of separating/splitting multi-layer printed circuit wiring boards by immersing the board and the blade of a surgical knife into liquid nitrogen to lower their temperatures to that of the liquid nitrogen thereby altering the holding properties of the adhesive material between the layers of the multi-layer board. Separating one layer at a time from the printed circuit wiring board until all layers of the multi-layer board have been removed.