Geoffrey G Reid

US Patent:

6975518, Dec 13, 2005

Filed:

May 28, 2003

Appl. No.:

10/446462

Inventors:

Kristopher Frutschy - Phoenix AZ, US
Glenn E. Stewart - Mesa AZ, US
Farzaneh Yahyaei-Moayyed - Chandler AZ, US
Geoffrey L. Reid - Mesa AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K007/10
H05K007/12
H05K003/30

US Classification:

361769, 361760, 361787, 361803, 29832

Abstract:

An electronic assembly includes one or more conductive clamps (, FIG. ), which are used to supply current to an integrated circuit (IC) package (). The conductive clamps are attached to a printed circuit (PC) board (), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad () on the surface of the PC board, and contacts another contact pad () on the top surface of the IC package. Vias () and conductive planes () within the package then carry current to and from an IC (e. g. , IC ) connected to the package. In another embodiment, the clamp (, FIG. ) holds a conductive structure () in place between the PC board contact pad () and the IC package contact pad (), and current is carried primarily over the conductive structure, rather than over the clamp.