Consolidated Services Group Jun 1998 - Oct 2007
Project Manager
The Network Support Company Jun 1998 - Oct 2007
Telecommunications Field Manager
Spectra Data 1988 - 1996
Technician
Education:
Brien Mcmahon High School
Skills:
Telecommunications Cabling Wan Data Center Switches Security Cisco Technologies Disaster Recovery Vpn Network Administration Servers Network Security Project Management Citrix Firewalls Routers Managed Services
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Us Patents
Chemical Mechanical Polishing Compositions, And Process For The Cmp Removal Of Iridium Thin Using Same
Michael W. Russell - Norwalk CT Peter C. Van Buskirk - Newtown CT Jonathan J. Wolk - Bridgewater CT George E. Emond - Southington CT
Assignee:
Intersurface Dynamics Inc. - Bethel CT Advanced Technology Materials, Inc. - Danbury CT
International Classification:
C09K 1300
US Classification:
252 791, 252 794, 438692
Abstract:
A method of removing noble metal material from a substrate having the noble metal material deposited thereon, such as a semiconductor device structure including thereon a layer of the noble metal material, e. g. , iridium, patterned for use as an electrode. The substrate is subjected to chemical mechanical polishing with a chemical mechanical polishing composition containing abrasive polishing particles and a halide-based oxidizing agent. The CMP composition and method of the invention provide efficient planarization and noble metal material removal from the substrate, in applications such as the fabrication of ferroelectric or high permittivity capacitor devices.
Chemical Mechanical Polishing Compositions For Cmp Removal Of Iridium Thin Films
Michael W. Russell - Norwalk CT Peter C. Van Buskirk - Newtown CT Jonathan J. Wolk - Bridgewater CT George E. Emond - Southington CT
Assignee:
Advanced Technology Materials, Inc. - Danbury CT
International Classification:
C09K 1300
US Classification:
252 791, 252 792, 438691, 438692
Abstract:
A chemical mechanical polishing (CMP) slurry composition for removing noble metal material from a substrate having the noble metal material deposited thereon, for example, a semiconductor device structure including thereon a layer of the noble metal material, e. g. , iridium, patterned for use as an electrode. Such polishing slurry composition contains abrasive polishing particles, a bromide compound, a bromate compound for providing free bromine as an oxidizing agent in the composition, and an organic acid for mediating decomposition of the bromate compound in the composition. The CMP slurry composition of the invention is particularly effective for planarization and/or removal of noble metal(s) from the substrate, in applications such as the fabrication of ferroelectric or high permittivity capacitor devices.
Charge Modified Microporous Membrane, Process For Charge Modifying Said Membrane And Process For Filtration Of Fluid
Eugene A. Ostreicher - Farmington CT Rodney A. Knight - New Milford CT Joseph V. Fiore - Fairfield CT George T. Emond - Southington CT Kenneth C. Hou - San Antonio TX
Assignee:
AMF Inc. - White Plains NY
International Classification:
B01D 1300
US Classification:
210636
Abstract:
A cationic charge modified microporous membrane, process for producing said membrane and use thereof are provided. The membrane comprises a hydrophilic organic polymeric microporous membrane and a charge modifying amount of a primary cationic charge modifying agent bonded to substantially all of the wetted surfaces of the membrane. The primary charge modifying agent if a water soluble organic polymer having a molecular weight greater than about 1000 wherein each monomer thereof has at least one epoxide group capable of bonding to the surface of the membrane and at least one tertiary amine or quaternary ammonium group. Preferably, a portion of the epoxy groups on the organic polymer are bonded to a secondary charge modifying agent selected from the group consisting of: (i) aliphatic amines having at least one primary amine or at least two secondary amines; and (ii) aliphatic amines having at least one secondary amine and a carboxyl or hydroxyl substituent. The charge modified microporous membrane of this invention may be used for the filtration of fluids, particularly parenteral or biological liquids. The membrane has low extractables and is sanitizable or sterilizable.
Eugene A. Ostreicher - Farmington CT Rodney A. Knight - New Milford CT Joseph V. Fiore - Fairfield CT George T. Emond - Southington CT Kenneth C. Hou - San Antonio TX
Assignee:
Cuno Inc. - Meriden CT
International Classification:
B01D 1300
US Classification:
21050022
Abstract:
A cationic charge modified microporous membrane comprising a hydrophilic organic polymeric microporous membrane and a cationic charge modifying agent bonded to substantially all of the wetted surfaces of the membrane, the charge modifying agent being an epichlorohydrin modified polyamide having tertiary amine or quaternary ammonium groups. A secondary charge modifying agent may be employed selected from: (i) aliphatic polyamines having at least one primary amine or at least two secondary amines; and (ii) aliphatic amines having at least one secondary amine and a carboxyl or hydroxyl substituent. Processes for producing and using the membrane are also described.
Liquid Filtration Using Hydrophilic Cationic Isotropic Microporous Nylon Membrane
Eugene A. Ostreicher - Farmington CT Rodney A. Knight - New Milford CT Joseph V. Fiore - Fairfield CT George T. Emond - Southington CT Kenneth C. Hou - San Antonio TX
Assignee:
Cuno Incorporated - Meriden CT
International Classification:
B01D 1300
US Classification:
210650
Abstract:
A cationic charge modified microporous membrane comprising a hydrophilic organic polymeric microporous membrane and a cationic charge modifying agent bonded to substantially all of the wetted surfaces of the membrane, the charge modifying agent being an epichlorohydrin modified polyamide having tertiary amine or quaternary ammonium groups. A secondary charge modifying agent may be employed selected from: (i) aliphatic polyamines having at least one primary amine or at least two secondary amines; and (ii) aliphatic amines having at least one secondary amine and a carboxyl or hydroxyl substituent. Processes for producing and using the membrane are also described.
Process For Charge Modifying A Microporous Membrane
Robert G. Barnes - Meriden CT Chaokang Chu - East Hartford CT George T. Emond - Southington CT Asit K. Roy - Seguin TX
Assignee:
Cuno Incorporated - Meriden CT
International Classification:
B01D 1300
US Classification:
264 48
Abstract:
A cationic charge modified microporous membrane is provided. The membrane comprises a hydrophilic organic polymeric microporous membrane having bonded thereto, through a cross-linking agent, a charge modifying amount of a cationic charge modifying agent. The charge modifying agent is an aliphatic amine or polyamine, preferably tetraethylene pentamine, and the cross-linking agent is an aliphatic polyepoxide having a molecular weight of less than about 500, preferably 1, 4 butanediol diglycidyl ether. The microporous membrane is preferably nylon. The process for applying the charge modifying agent to the membrane, preferably comprises contacting the membrane with an aqueous solution of the charge modifying agent and then contacting the membrane with a substantially aqueous solution of the cross-linking agent. The preferred process uses high purity water, i. e. water having no significant ionic content, to produce a membrane suitable for use in filtering ultra pure (18 megohm-cm resistivity) water for use in producing electronic devices.
Process For Charge Modifying A Microphorous Membrane
Eugene A. Ostreicher - Farmington CT Rodney A. Knight - New Milford CT Joseph V. Fiore - Fairfield CT George T. Emond - Southington CT Kenneth C. Hou - San Antonio TX
Assignee:
Cuno Incorporated - Meriden CT
International Classification:
B05D 500
US Classification:
427244
Abstract:
A process is provided for for cationically charge modifying a microporous filter membrane, wherein the membrane is a substantially symmetrical isotropic, hydrophilic, organic polymeric microporous filter membrane, preferably nylon, having a microstructure throughout the membrane. The process comprises bonding a primary charge modifying amount of a water soluble cationic charge modifying agent to substantially all of the membrane microstructure, without substantial pore size reduction or pore blockage. The charge modifying agent is a reaction product of a polyamine with epichlorohydrin, the reactive product having (i) tertiary amine or quaternary ammonium groups, and (ii) epoxide groups along a polyamine chain, the epoxide groups capable of bonding to the microstructure of the membrane.
Method Of Abrading With Boron Suboxide (Bxo) And The Boron Suboxide (Bxo) Articles And Composition Used
George T. Emond - Southington CT Shih Y. Kuo - Salt Lake City UT
Assignee:
Norton Company - Worcester MA
International Classification:
C09K 314
US Classification:
51307
Abstract:
A method of removing material from a surface comprising abrading a surface comprising the step of abrading a surface with an abrasive tool or an abrasive powder comprising a boron suboxide (BxO) composition, wherein during the abrading step the boron suboxide (BxO) composition is maintained at low temperatures. The abrasive which is from the boron suboxide (BxO) family of compounds exhibits an unexpectedly high quality of abrading comparable with the highest quality particulate natural and synthetic diamond, which has a hardness about double that of the boron suboxide (BxO) of the present invention. Further, the invention includes a lapping and polishing powder and lapping slurry wherein the powder is made from a dense, finely crystalline boron suboxide material with a Knoop hardness KHN. sub. 100 of at least about 2800 kg/mm. sup. 2 and preferably at least 3800 kg/mm. sup. 2.