George A Linke

US Patent:

46494502, Mar 10, 1987

Filed:

Dec 12, 1984

Appl. No.:

6/680873

Inventors:

George A. Linke - San Francisco CA

Assignee:

Ampex Corporation - Redwood City CA

International Classification:

G11B 510

US Classification:

360129

Abstract:

A nonmagnetic holder is made having a plurality of precisely located parallel grooves. Each groove has a reference lateral surface provided therein. Individual magnetic transducers are inserted in each groove with a lateral surface abutting the reference lateral surface within that groove. The transducers are preferably made by well known batch fabrication techniques. A locating element, such as a leaf spring, is provided in each groove to urge the transducer core against the reference surface and to firmly hold the transducer in a desired position during alignment and assembly. The modular structure allows inspecting the individual transducers for mechanical or electrical damages and their replacement, if necessary, prior to the final assembly. The multichannel head is then integrally joined together, for example by bonding. The rejection rate of the resulting modular multichannel head is significantly reduced.

US Patent:

46883266, Aug 25, 1987

Filed:

Aug 26, 1986

Appl. No.:

6/900647

Inventors:

George A. Linke - San Francisco CA

Assignee:

Ampex Corporation - Redwood City CA

International Classification:

G11B 542

US Classification:

29603

Abstract:

A nonmagnetic holder is made having a plurality of precisely located parallel grooves. Each groove has a reference lateral surface provided therein. Individual magnetic transducers are inserted in each groove with a lateral surface abutting the reference lateral surface within that groove. The transducers are preferably made by well known batch fabrication techiques. A locating element, such as a leaf spring, is provided in each groove to urge the transducer core against the reference surface and to firmly hold the transducer in a desired position during alignment and assembly. The modular structure allows inspecting the individual transducers for mechanical or electrical damages and their replacement, if necessary, prior to the final assembly. The multichannel head is then integrally joined together, for example by bonding. The rejection rate of the resulting modular multichannel head is significantly reduced.