George Walker

US Patent:

7355271, Apr 8, 2008

Filed:

Sep 30, 2003

Appl. No.:

10/573561

Inventors:

Richard P. Volant - New Fairfield CT, US
Kevin S. Petrarca - Newburgh NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/02

US Classification:

257686, 257685, 257E25006, 257E25013, 257E25018, 257E25021, 257E25027, 257E25085, 257E21614, 438109

Abstract:

A three-dimensional package consisting of a plurality of folded integrated circuit chips () is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip () is provided with additional interconnect wiring to a substrate (), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.

US Patent:

7546670, Jun 16, 2009

Filed:

May 5, 2006

Appl. No.:

11/429419

Inventors:

Timothy J. Dalton - Ridgefield CT, US
Anna Karecki, legal representative - Brooklyn NY, US
Samuel R. McKnight - New Paltz NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23P 13/04
H01R 43/00

US Classification:

29557, 29825, 29874, 29876, 29881, 324754, 324761

Abstract:

A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while still in wafer form, and throughout a range of temperatures. A guide plate and a contactor assembly for such use, comprising a substrate formed of a material having a coefficient of thermal expansion approximately equal to that of the device; and at least one hole in the guide plate for receiving an electrical contact (probe element) for contacting at least one respective region on said surface, said at least one hole being sized and shaped so as to accept said electrical contact, while allowing said electrical contact (probe element) to move with respect to said hole in said guide plate. The material can be one of silicon, borosilicate glass and cordierite.

US Patent:

8273591, Sep 25, 2012

Filed:

Mar 25, 2008

Appl. No.:

12/054886

Inventors:

Harold J. Hovel - Katonah NY, US
Qiang Huang - Sleepy Hollow NY, US
Xiaoyan Shao - Yorktown Heights NY, US
James Vichiconti - Peekskill NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/00

US Classification:

438 39, 438 46, 438 47, 438606, 438652, 438669, 438733, 438737, 257288, 257E29255, 257E31034

Abstract:

Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.

US Patent:

20120286236, Nov 15, 2012

Filed:

Jul 23, 2012

Appl. No.:

13/555383

Inventors:

Harold J. HOVEL - Katonah NY, US
Qiang Huang - Sleepy Hollow NY, US
Xiaoyan Shao - Yorktown Heights NY, US
James Vichiconti - Carmel NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 29/06
B82Y 99/00

US Classification:

257 9, 257E29024, 977762

Abstract:

Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.

US Patent:

51374617, Aug 11, 1992

Filed:

Oct 30, 1990

Appl. No.:

7/606007

Inventors:

Perminder S. Bindra - South Salem NY
Jerome J. Cuomo - Lincolndale NY
Thomas P. Gall - Endwell NY
Anthony P. Ingraham - Endicott NY
Sung K. Kang - Chappaqua NY
Paul Lauro - Pomona NY
David N. Light - Friendsville PA
Voya R. Markovich - Endwell NY
Ekkehard F. Miersch - Schoenaich, DE
Jaynal A. Molla - Endicott NY
Douglas O. Powell - Endicott NY
John J. Ritsko - Mount Kisco NY
George J. Saxenmeyer - Apalachin NY
Jack A. Varcoe - Endwell NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NJ

International Classification:

H01R 909

US Classification:

439 74

Abstract:

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

US Patent:

56821433, Oct 28, 1997

Filed:

Sep 9, 1994

Appl. No.:

8/303976

Inventors:

Michael John Brady - Brewster NY
Thomas Cofino - Rye NY
Harley Kent Heinrich - Brewster NY
Glen Walden Johnson - Yorktown Heights NY
Paul Andrew Moskowitz - Yorktown Heights NY
George Frederick Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G08B 1314

US Classification:

340572

Abstract:

A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

US Patent:

59721561, Oct 26, 1999

Filed:

Aug 21, 1997

Appl. No.:

8/915893

Inventors:

Michael John Brady - Brewster NY
Thomas Cofino - Rye NY
Harley Kent Heinrich - Brewster NY
Glen Walden Johnson - Yorktown Heights NY
Paul Andrew Moskowitz - Yorktown Heights NY
George Frederick Walker - New York NY

Assignee:

Intermec IP Corp. - Cedar Rapids IA

International Classification:

B32B 3100
B32B 3120
G08B 1314

US Classification:

156280

Abstract:

The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

US Patent:

51850737, Feb 9, 1993

Filed:

Apr 29, 1991

Appl. No.:

7/692606

Inventors:

Perminder S. Bindra - South Salem NY
Jerome J. Cuomo - Lincolndale NY
Thomas P. Gall - Endwell NY
Anthony P. Ingraham - Endicott NY
Sung K. Kang - Chappaqua NY
Paul Lauro - Pomona NY
David N. Light - Friendsville PA
Voya R. Markovich - Endwell NY
Ekkehard F. Miersch - Schoenaich, DE
Jaynal A. Molla - Endicott NY
Douglas O. Powell - Endicott NY
John J. Ritsko - Mount Kisco NY
George J. Saxenmeyer - Apalachin NY
Jack A. Varcoe - Endwell NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C25D 518

US Classification:

205104

Abstract:

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.