George A Walker

US Patent:

6534863, Mar 18, 2003

Filed:

Feb 9, 2001

Appl. No.:

09/781121

Inventors:

George F. Walker - New York NY
Ronald D. Goldblatt - Yorktown Heights NY
Peter A. Gruber - Mohegan Lake NY
Raymond R. Horton - Dover Plains NY
Kevin S. Petrarca - Newburgh NY
Richard P. Volant - New Fairfield CT
Tien-Jen Cheng - Bedford NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257737, 257751, 257761, 257762, 257766, 257769, 257781, 257784

Abstract:

A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

US Patent:

8613908, Dec 24, 2013

Filed:

Apr 29, 2008

Appl. No.:

12/111503

Inventors:

George F. Walker - New York NY, US

International Classification:

A61K 9/44

US Classification:

424 102

Abstract:

The invention is a pharmaceutical product which may be authenticated, comprising identifying markers disposed in the pharmaceutical product. The pharmaceutical product is selected from the group consisting of a pill, a tablet, a caplet, and a capsule. The identifying markers are gel pellets made from a hydroscopic medium having an indicia imprinted thereon and expand volumetrically when contacted with a liquid.

US Patent:

8641879, Feb 4, 2014

Filed:

Sep 12, 2012

Appl. No.:

13/611662

Inventors:

Stefan Harrer - New York NY, US
Binquan Luan - Ossining NY, US
Glenn J. Martyna - Croton on Hudson NY, US
Hongbo Peng - Chappaque NY, US
Stanislav Polonsky - Putnam Valley NY, US
Stephen M. Rossnagel - Pleasantville NY, US
Ajay K. Royyuru - Congers NY, US
Gustavo A. Stolovitzky - Riverdale NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01N 27/26

US Classification:

204451

Abstract:

A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

US Patent:

20030092254, May 15, 2003

Filed:

Dec 18, 2002

Appl. No.:

10/322831

Inventors:

George Walker - New York NY, US
Ronald Goldblatt - Yorktown Heights NY, US
Peter Gruber - Mohegan Lake NY, US
Raymond Horton - Dover Plains NY, US
Kevin Petrarca - Newburgh NY, US
Richard Volant - New Fairfield CT, US
Tien-Jen Cheng - Bedford NY, US

International Classification:

H01L021/44

US Classification:

438/613000

Abstract:

A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

US Patent:

20130068617, Mar 21, 2013

Filed:

Sep 16, 2011

Appl. No.:

13/234276

Inventors:

Stefan Harrer - New York NY, US
Binquan Luan - Ossining NY, US
Glenn J. Martyna - Croton on Hudson NY, US
Hongbo Peng - Chappaque NY, US
Stanislav Polonsky - Putnam Valley NY, US
Stephen M. Rossnagel - Pleasantville NY, US
Ajay K. Royyuru - Congers NY, US
Gustavo A. Stolovitzky - Riverdale NY, US
George F. Walker - New York NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

C25B 7/00
C25B 15/00
B82Y 99/00

US Classification:

204451, 204601, 977700, 977962

Abstract:

A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

US Patent:

55828582, Dec 10, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/474985

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

427 96

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

52999394, Apr 5, 1994

Filed:

Mar 5, 1992

Appl. No.:

7/847970

Inventors:

George F. Walker - New York NY
Arthur Zingher - White Plains NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

439 74

Abstract:

A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.

US Patent:

53374754, Aug 16, 1994

Filed:

Dec 17, 1992

Appl. No.:

7/992091

Inventors:

Farid Y. Aoude - Wappingers NY
Emanuel I. Cooper - Riverdale NY
Peter R. Duncombe - Peekskill NY
Shaji Farooq - Hopewell Junction NY
Edward A. Giess - Purdys Station NY
Young-Ho Kim - Seoul, KR
Sarah H. Knickerbocker - Hopewell Junction NY
Friedel Muller-Landau - Putnam Valley NY
Mark O. Neisser - Wappingers Falls NY
Jae M. Park - Somers NY
Robert R. Shaw - Poughkeepsie NY
Robert A. Rita - Wappingers Falls NY
Thomas M. Shaw - Peekskill NY
Rao Vallabhaneni - Wappingers Falls NY
Jon A. Van Hise - Brookfield CT
George F. Walker - New York NY
Jungihl Kim - Seoul, KR
James M. Brownlow - late of Norwich VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01K 310

US Classification:

29852

Abstract:

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0. 5 and 6. mu. m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.