George E Walker

US Patent:

6534863, Mar 18, 2003

Filed:

Feb 9, 2001

Appl. No.:

09/781121

Inventors:

George F. Walker - New York NY
Ronald D. Goldblatt - Yorktown Heights NY
Peter A. Gruber - Mohegan Lake NY
Raymond R. Horton - Dover Plains NY
Kevin S. Petrarca - Newburgh NY
Richard P. Volant - New Fairfield CT
Tien-Jen Cheng - Bedford NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257737, 257751, 257761, 257762, 257766, 257769, 257781, 257784

Abstract:

A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

US Patent:

8613908, Dec 24, 2013

Filed:

Apr 29, 2008

Appl. No.:

12/111503

Inventors:

George F. Walker - New York NY, US

International Classification:

A61K 9/44

US Classification:

424 102

Abstract:

The invention is a pharmaceutical product which may be authenticated, comprising identifying markers disposed in the pharmaceutical product. The pharmaceutical product is selected from the group consisting of a pill, a tablet, a caplet, and a capsule. The identifying markers are gel pellets made from a hydroscopic medium having an indicia imprinted thereon and expand volumetrically when contacted with a liquid.

US Patent:

8641879, Feb 4, 2014

Filed:

Sep 12, 2012

Appl. No.:

13/611662

Inventors:

Stefan Harrer - New York NY, US
Binquan Luan - Ossining NY, US
Glenn J. Martyna - Croton on Hudson NY, US
Hongbo Peng - Chappaque NY, US
Stanislav Polonsky - Putnam Valley NY, US
Stephen M. Rossnagel - Pleasantville NY, US
Ajay K. Royyuru - Congers NY, US
Gustavo A. Stolovitzky - Riverdale NY, US
George F. Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01N 27/26

US Classification:

204451

Abstract:

A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

US Patent:

20030092254, May 15, 2003

Filed:

Dec 18, 2002

Appl. No.:

10/322831

Inventors:

George Walker - New York NY, US
Ronald Goldblatt - Yorktown Heights NY, US
Peter Gruber - Mohegan Lake NY, US
Raymond Horton - Dover Plains NY, US
Kevin Petrarca - Newburgh NY, US
Richard Volant - New Fairfield CT, US
Tien-Jen Cheng - Bedford NY, US

International Classification:

H01L021/44

US Classification:

438/613000

Abstract:

A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

US Patent:

20130068617, Mar 21, 2013

Filed:

Sep 16, 2011

Appl. No.:

13/234276

Inventors:

Stefan Harrer - New York NY, US
Binquan Luan - Ossining NY, US
Glenn J. Martyna - Croton on Hudson NY, US
Hongbo Peng - Chappaque NY, US
Stanislav Polonsky - Putnam Valley NY, US
Stephen M. Rossnagel - Pleasantville NY, US
Ajay K. Royyuru - Congers NY, US
Gustavo A. Stolovitzky - Riverdale NY, US
George F. Walker - New York NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

C25B 7/00
C25B 15/00
B82Y 99/00

US Classification:

204451, 204601, 977700, 977962

Abstract:

A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

US Patent:

46422544, Feb 10, 1987

Filed:

Mar 4, 1986

Appl. No.:

6/835890

Inventors:

George E. Walker - Longmeadow MA

Assignee:

Monsanto Company - St. Louis MO

International Classification:

B29C 6100

US Classification:

428 36

Abstract:

A process and device utilizing the memory characteristics of cross-linked polymers for temporarily holding and releasing parts or components is presented. In a first step, a polymeric material or part capable of being cross-linked is formed into a first "memory" shape. Thereafter, in a next step, the polymer is cross-linked via irradiation or any other suitable technique to fix or lock the polymer into the first memory shape. Next, the polymer is heated and deformed to a second shape and thereafter cooled to lock in that second shape. During the deformation process, the cross-linked polymer will preferably be deformed about a second component or part so that upon cooling, the second part will be tightly held by the deformed polymer. Thus, the second part or component will be temporarily held for any desired length of time. When it is desired to release the second part, the deformed cross-linked polymer part is subjected to a second heating (above its transition temperature) whereupon the polymer will revert back to its first memory shape and thereby release the second part or component held therein.

US Patent:

55828582, Dec 10, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/474985

Inventors:

Eleftherios Adamopoulos - Bronx NY
Jungihl Kim - Seoul, KR
Kang-Wook Lee - Yorktown Heights NY
Tae S. Oh - Seoul, KR
Terrence R. O'Toole - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
John J. Ritsko - Mount Kisco NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Stormville NY
George F. Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 510

US Classification:

427 96

Abstract:

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines.

US Patent:

47498560, Jun 7, 1988

Filed:

May 29, 1986

Appl. No.:

6/868628

Inventors:

George E. Walker - Longmeadow MA
William K. Fisher - New Britain CT

Assignee:

Monsanto Company - St. Louis MO

International Classification:

H01J 516

US Classification:

250227

Abstract:

An optical sensing device which incorporates a suitable optical sensor system, preferably a fiber optics system, with a suitable environmental sensitive polymeric material is presented. The polymeric material must be of the type which undergoes wavelength-independent changes in optical properties in response to environmental changes. Accordingly, preferred polymers include crosslinked, semicrystalline polymers, high strength amorphous polymers, and polymer blends. This novel combination will accurately and, at times, reversibly measure and detect temperature, humidity, pressure, position, radiation, flow, stress/strain, light, color, electric field, and a plurality of other properties with respect to changes in the environment.