Gerald A Fields

US Patent:

6894376, May 17, 2005

Filed:

Jun 9, 2003

Appl. No.:

10/458433

Inventors:

Shahram Mostafazadeh - San Jose CA, US
Gerald Alexander Fields - Saratoga CA, US

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L023/495
H01L023/48

US Classification:

257684, 257796, 257712, 257713, 257666, 257696, 257676, 257675, 257717, 257720, 257775, 257776, 257784, 257786, 257787

Abstract:

Arrangements and methods of packaging integrated circuits in leadless leadframe packages configured for maximizing a die size are disclosed. The package is described having an exposed die attach pad and a plurality of exposed contacts formed from a common substrate material. The contacts, however, are thinned relative to the die attach pad. In one embodiment, an inner region of the contacts is thinned. In another embodiment, an outer region of the contacts is also thinned. A die is mounted on the die attach pad and wire bonded to the contacts. Since the inner region and sometimes together with the outer region of the contact are lower than the die attach pad being wire bonded to, the size of the die can be relatively increased to overhang over the contact, thereby maximizing the die size in the package. A plastic cap is molded over the die, contacts, and bonding wires while leaving the bottom surface of the contacts exposed.

US Patent:

7288439, Oct 30, 2007

Filed:

May 5, 2005

Appl. No.:

11/123567

Inventors:

Shahram Mostafazadeh - San Jose CA, US
Gerald Alexander Fields - Saratoga CA, US

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 21/00

US Classification:

438123, 438110, 438111, 438112, 438113, 438121, 438124

Abstract:

Arrangements and methods of packaging integrated circuits in leadless leadframe packages configured for maximizing a die size are disclosed. The package is described having an exposed die attach pad and a plurality of exposed contacts formed from a common substrate material. The contacts, however, are thinned relative to the die attach pad. In one embodiment, an inner region of the contacts is thinned. In another embodiment, an outer region of the contacts is also thinned. A die is mounted on the die attach pad and wire bonded to the contacts. Since the inner region and sometimes together with the outer region of the contact are lower than the die attach pad being wire bonded to, the size of the die can be relatively increased to overhang over the contact, thereby maximizing the die size in the package. A plastic cap is molded over the die, contacts, and bonding wires while leaving the bottom surface of the contacts exposed.