Gerald L Johnson

US Patent:

45344604, Aug 13, 1985

Filed:

Jan 14, 1983

Appl. No.:

6/457970

Inventors:

James T. Graham - Rochester MI
Gerald E. Johnson - Flint MI

Assignee:

Lamb Technicon Corp. - Warren MI

International Classification:

B65A 4784

US Classification:

198482

Abstract:

A pocket conveyor, specifically a pocket elevator, in which a plurality of spools are cantilevered from an endless drive chain. The spools cooperate with each other and with stationary guide rails to form a series of pockets for conveying workpieces between feed and discharge stations. Various embodiments of the feed station include a starwheel rotating in synchronism with urging workpieces into recesses between the starwheel fingers. This guide surface has a clearance at the inlet and which cooperates with deformable construction of the starwheel fingers to prevent workpiece jam at the feed station. Another embodiment of the feed station includes a flat angulated surface for receiving workpieces by gravity and a flexible reach of chain extending at an angle toward the workpiece surface for automatically accommodating itself to workpiece availability without jamming. The discharge station includes a second starwheel with fingers which enter successive pockets and displace workpieces therefrom.

US Patent:

54061253, Apr 11, 1995

Filed:

Apr 15, 1993

Appl. No.:

8/000227

Inventors:

Gerald E. Johnson - Littleton CO
Michael D. Medley - Elizabeth CO

Assignee:

Martin Marietta Corp. - Bethesda MD

International Classification:

H01L 2302
H01L 2313
H01P 308

US Classification:

257774

Abstract:

A semiconductor device having a metalized via hole used when mounting and connecting semiconductor chips, such as microwave chips, digital chips, analog chips and the like, on a top portion of a metalized carrier substrate is described herein. Each chip includes electrical circuitry on a top portion thereof with the circuitry connected to one end of a transmission line. Another end of the transmission line is connected to a metalized via hole. The via hole passes from the top portion of the chip to a bottom portion of the chip. The chip when mounted on the substrate is positioned over the top portion of the substrate and lowered thereon either by hand or with a mechanical chip carrying device. The bottom portion of the metalized via hole is indexed over a top of one end of a transmission line on the top portion of the substrate with the indexing tolerance between the two interfacing surfaces in a range of 0. 5 to 10 mils.