Gerard P O'Neil

age ~51

from Herndon, VA

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Also known as:

Gerard Peter O'Neil
Gerard O-Neil
Gerard O Neil
Gerard P O'Neill
Gerard Oniel
Jerald Oniel

Connected to:

Gerard O'Neil Phones & Addresses

Herndon, VA
Newark, DE
Baltimore, MD
Radford, VA
Elkins, WV
Claymont, DE
Silver Spring, MD
26 Greenridge Rd, Newark, DE 19711

Work

Company:

Xpo logistics, inc.
Oct 2019
Position:

Operations manager, supply chain

Education

Degree:

Bachelors, Bachelor of Science
School / High School:

West Virginia University
1994 to 1996
Specialities:

Mechanical Engineering

Skills

Six Sigma • Continuous Improvement • Lean Manufacturing • Process Improvement • Manufacturing • Process Engineering • 5S • Leadership • Supply Chain Management • Supply Chain • Management • Engineering • Spc • Root Cause Analysis • Design of Experiments • Kaizen • Dmaic • Project Management • Process Simulation • Minitab • Cross Functional Team Leadership • Polymers • Chemical Engineering • Process Safety • Manufacturing Operations Management • Coaching • Iso • Fmea • Coatings • Value Stream Mapping • Validation • Change Management • Mindsets and Behaviors • Quality System

Ranks

Certificate:

Lean Six Sigma Black Belt

Interests

Human Rights • Children • Education • Disaster and Humanitarian Relief

Industries

Logistics And Supply Chain

Resumes

Operations Manager, Supply Chain

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Location:

12817 Briery River Ter, Herndon, VA 20170

Industry:

Logistics And Supply Chain

Work:

Xpo Logistics, Inc.
Operations Manager, Supply Chain
Saint-Gobain Performance Plastics Jun 2018 - Sep 2019
Plant Engineering and Facilities Manager
Saint-Gobain Performance Plastics Mar 2016 - Dec 2018
Production Manager
Toray Plastics (America), Inc. Jun 2015 - Mar 2016
Production Manager
Axalta Coating Systems Aug 2013 - Jun 2015
Area Manager, Contract Administration

Education:

West Virginia University 1994 - 1996
Bachelors, Bachelor of Science, Mechanical Engineering Davis and Elkins College 1991 - 1994

Skills:

Six Sigma
Continuous Improvement
Lean Manufacturing
Process Improvement
Manufacturing
Process Engineering
5S
Leadership
Supply Chain Management
Supply Chain
Management
Engineering
Spc
Root Cause Analysis
Design of Experiments
Kaizen
Dmaic
Project Management
Process Simulation
Minitab
Cross Functional Team Leadership
Polymers
Chemical Engineering
Process Safety
Manufacturing Operations Management
Coaching
Iso
Fmea
Coatings
Value Stream Mapping
Validation
Change Management
Mindsets and Behaviors
Quality System

Interests:

Human Rights
Children
Education
Disaster and Humanitarian Relief

Certifications:

Lean Six Sigma Black Belt

Us Patents

Metal Compositions, Thermal Imaging Donors And Patterned Multilayer Compositions Derived Therefrom
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US Patent:

7582403, Sep 1, 2009
Filed:

Jul 17, 2006
Appl. No.:

11/488247
Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Greenville DE, US
Jonathan V. Caspar - Wilmington DE, US
John W. Catron - Smyrna DE, US
Reid John Chesterfield - Wilmington DE, US
Thomas C. Felder - Kennett Square PA, US
Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Rinaldo S. Schiffino - Wilmington DE, US
Nancy G. Tassi - Gibbstown NJ, US
Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE
International Classification:

B41M 5/40
H01B 1/22
G03C 3/00
G03C 5/18
US Classification:

430200, 430 18, 252500
Abstract:

The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Metal Compositions, Thermal Imaging Donors And Patterned Multilayer Compositions Derived Therefrom
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US Patent:

7901596, Mar 8, 2011
Filed:

Jun 19, 2009
Appl. No.:

12/487883
Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Jonathan V Caspar - Wilmington DE, US
John Catron, Jr. - Smyrna DE, US
Reid John Chesterfield - Santa Barbara CA, US
Thomas C. Felder - Kennett Square PA, US
Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Rinaldo Soria Schiffino - Wilmington DE, US
Nancy G. Tassi - Gibbstown NJ, US
Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE
International Classification:

H01B 1/02
H01B 1/22
US Classification:

252512, 252514
Abstract:

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Metal Compositions, Thermal Imaging Donors And Patterned Multilayer Compositions Derived Therefrom
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US Patent:

8440383, May 14, 2013
Filed:

Jan 26, 2011
Appl. No.:

13/013876
Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Jonathan V. Caspar - Wilmington DE, US
John Catron, Jr. - Smyrna DE, US
Reid John Chesterfield - Santa Barbara CA, US
Thomas C. Felder - Kennett PA, US
Feng Gao - Hockessin DE, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Dalen E. Keys - Landenberg PA, US
Irina Malajovich - Swarthmore PA, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Rinaldo Soria Schiffino - Wilmington DE, US
Nancy G. Tassi - Gibbstown NJ, US
Assignee:

E I du Pont de Nemours and Company - Wilmington DE
International Classification:

G03C 3/00
G03C 5/00
G03C 8/00
US Classification:

430200, 430 18, 430964
Abstract:

Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Thin Film Transistor Comprising Novel Conductor And Dielectric Compositions
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US Patent:

20080012006, Jan 17, 2008
Filed:

Jul 17, 2006
Appl. No.:

11/488200
Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Greenville DE, US
John W. Catron - Smyrna DE, US
Reid John Chesterfield - Wilmington DE, US
Feng Gao - Hockessin DE, US
Howard David Glicksman - Durham NC, US
Marc B. Goldfinger - West Chester PA, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Irina Malajovich - Swarthmore NC, US
Hong Meng - Wilmington DE, US
Jeffrey Scott Meth - Landenberg PA, US
Gerard O'Neil - Newark DE, US
Kenneth George Sharp - Landenberg PA, US
Nancy G. Tassi - Gibbstown NJ, US
Geoffrey Nunes - Swarthmore PA, US
International Classification:

H01L 51/10
H01L 29/786
US Classification:

257 40, 257347, 257E29273, 257E51006
Abstract:

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Thin Film Transistor Comprising Novel Conductor And Dielectric Compositions
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US Patent:

20090179198, Jul 16, 2009
Filed:

Mar 13, 2009
Appl. No.:

12/403685
Inventors:

Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Wilmington DE, US
Reid John Chesterfield - Santa Barbara CA, US
Howard David Glicksman - Durham NC, US
Marc B. Goldfinger - West Chester PA, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Roupen Leon Keusseyan - Raleigh NC, US
Irina Malajovich - Swarthmore PA, US
Hong Meng - Wilmington DE, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Kenneth George Sharp - Landenberg PA, US
Feng Gao - Hockessin DE, US
Assignee:

E.I. DU PONT DE NEMOURS AND COMPANY - Wilmington DE
International Classification:

H01L 51/10
US Classification:

257 40, 977742, 977773, 257347, 257E51003
Abstract:

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Thermally Imageable Dielectric Layers, Thermal Transfer Donors And Receivers
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US Patent:

20100239793, Sep 23, 2010
Filed:

Jul 17, 2006
Appl. No.:

11/488263
Inventors:

Gerald Donald Andrews - Hockessin DE, US
Richard Kevin Bailey - Newark DE, US
Graciela Beatriz Blanchet - Greenville DE, US
Jonathan V. Caspar - Wilmington DE, US
John Catron - Smyrna DE, US
Reid John Chesterfield - Wilmington DE, US
Feng Gao - Hockessin DE, US
Marc B. Goldfinger - West Chester PA, US
Gary Delmar Jaycox - West Chester PA, US
Lynda Kaye Johnson - Wilmington DE, US
Irina Malajovich - Swarthmore P DE, US
William J. Marshall - Wilmington DE, US
Elizabeth Forrester McCord - Hockessin DE, US
Charles Nehemiah McEwan - Newark DE, US
Jeffrey Scott Meth - Landenberg PA, US
Geoffrey Nunes - Swarthmore PA, US
Gerard O'Neil - Newark DE, US
Paul J. Shannon - Exton PA, US
Kenneth George Sharp - Landenberg PA, US
Karyn B. Visscher - Voorhees NJ, US
International Classification:

B41M 5/385
B32B 27/08
B32B 27/30
B32B 27/32
B32B 5/16
B41M 5/382
B41M 5/46
B41M 5/395
G02B 5/22
US Classification:

428 3269, 428515, 428520, 428323, 428 3287, 428 3285, 428 328, 428 3286, 428 3277, 252587
Abstract:

The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.