Gerry P Balanon

US Patent:

6706563, Mar 16, 2004

Filed:

Apr 10, 2002

Appl. No.:

10/119920

Inventors:

Il Kwon Shim - Singapore, SG
Hermes T. Apale - Singapore, SG
Gerry Balanon - San Jose CA

Assignee:

ST Assembly Test Services PTE LTD - Singapore

International Classification:

H01L 2144

US Classification:

438125, 438122, 438123, 438124, 438126, 438127, 257675, 257688, 257706, 257707, 257796

Abstract:

A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate. Under an additional embodiment of the invention, extremities if the heat spreader stand-off are aligned with contact pads provided over the second surface of the substrate of the package, thermally conductive epoxy is deposited over the contact surfaces between the extremities and the contact pads.

US Patent:

6534859, Mar 18, 2003

Filed:

Apr 5, 2002

Appl. No.:

10/116983

Inventors:

Il Kwon Shim - Singapore, SG
Seng Guan Chow - Singapore, SG
Gerry Balanon - San Jose CA

Assignee:

St. Assembly Test Services Ltd. - Singapore

International Classification:

H01L 23495

US Classification:

257706, 257675, 257707, 257787, 257796, 257783, 257719, 438124, 438126, 438127, 438106, 438122

Abstract:

A new method and package is provided for face-up packaging of semiconductor devices. The semiconductor device is mounted over the surface of a semiconductor device support surface using conventional methods of device packaging up through device bond wire interconnect to electrical traces on the surface of the semiconductor device support surface over which the device is mounted. An internal mold cap is formed over the device, the internal mold cap has an opening exposing the surface of the device. An external mold cap is formed surrounding the internal mold cap with a cavity separating the external mold cap from the internal mold cap. Thermally conductive epoxy is deposited in the opening of the internal mold cap and in the cavity between the internal and the external mold cap. The heat spreader is placed and attached after which a thermal epoxy and mold cure is applied to the package. The package is further completed by the application of contact balls to a first surface of the semiconductor device support surface, the semiconductor devices is mounted has been mounted over a second surface of the semiconductor device support surface.