Glen D Taylor

US Patent:

40370470, Jul 19, 1977

Filed:

Dec 31, 1974

Appl. No.:

5/537714

Inventors:

Glen J. Taylor - Winter Park FL

Assignee:

Martin Marietta Corporation - Orlando FL

International Classification:

H05K 114
H05K 330

US Classification:

174 685

Abstract:

Method and structure for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned relationship between rigid layers equipped with suitable electrical connections. All of the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in preselected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition. By keeping the rigid layers intact, the assemblage is maintained rigid during the plating procedure, thereby avoiding undesirable work hardening of the flexible portions even without tools for restraining the flexible portions. The selective bonding and preslotting permits the ready removal of the rigid material from certain portions of the assemblage to form the circuit board with integral flexible conductor appendages.