Glenn T Ibarreta

age ~59

from Ridgefield, WA

Also known as:
  • Glenn T Ibaretta
  • Guenn T Ibarreta
  • Glen T Ibarreta
Phone and address:
3004 173Rd St, Ridgefield, WA 98642
3605668414

Glenn Ibarreta Phones & Addresses

  • 3004 173Rd St, Ridgefield, WA 98642 • 3605668414
  • 10105 21St St, Vancouver, WA 98664
  • 6302 Wilding Rd, Vancouver, WA 98686 • 3605463121
  • Hillsboro, OR
  • Suisun City, CA
  • Portland, OR
  • Fremont, CA

Vehicle Records

  • Glenn Ibarreta

    view source
  • Address:
    3004 NE 173 St, Ridgefield, WA 98642
  • Phone:
    3605668414
  • VIN:
    2A8HR54PX8R124767
  • Make:
    CHRYSLER
  • Model:
    TOWN AND COUNTRY
  • Year:
    2008

Us Patents

  • Method And Apparatus For Electroplating

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  • US Patent:
    8308931, Nov 13, 2012
  • Filed:
    Nov 7, 2008
  • Appl. No.:
    12/291356
  • Inventors:
    Jonathan Reid - Sherwood OR, US
    Bryan Buckalew - Tualatin OR, US
    Zhian He - Beaverton OR, US
    Seyang Park - Beaverton OR, US
    Seshasayee Varadarajan - Lake Oswego OR, US
    Bryan Pennington - Tualatin OR, US
    Thomas Ponnuswamy - Sherwood OR, US
    Patrick Breling - Portland OR, US
    Glenn Ibarreta - Ridgefield WA, US
    Steven Mayer - Lake Oswego OR, US
  • Assignee:
    Novellus Systems, Inc. - San Jose CA
  • International Classification:
    C25D 21/12
    C25D 7/12
    C25D 3/38
  • US Classification:
    205 96, 205 97, 2042307
  • Abstract:
    An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

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