Jonathan Reid - Sherwood OR, US Bryan Buckalew - Tualatin OR, US Zhian He - Beaverton OR, US Seyang Park - Beaverton OR, US Seshasayee Varadarajan - Lake Oswego OR, US Bryan Pennington - Tualatin OR, US Thomas Ponnuswamy - Sherwood OR, US Patrick Breling - Portland OR, US Glenn Ibarreta - Ridgefield WA, US Steven Mayer - Lake Oswego OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 21/12 C25D 7/12 C25D 3/38
US Classification:
205 96, 205 97, 2042307
Abstract:
An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.