Brooks Automation
Product Line Director, Fab Solutions
Jdsu May 2010 - Sep 2013
Product Management and Business Development
Asyst Technologies Jul 2003 - Sep 2009
Product Management and General Management
Tti Silicon 2001 - 2002
Member Board of Directors
Applied Materials 1983 - 2002
Product Management and General Management
Education:
Oregon State University 1973 - 1978
Bachelors, Bachelor of Science, Nuclear Engineering
Skills:
Semiconductor Industry Product Development Optics Semiconductors Program Management Product Marketing Engineering Management Cross Functional Team Leadership Product Management Product Lifecycle Management Business Development Project Management Start Ups R&D Sales Strategy Strategic Planning Thin Films Manufacturing Electronics Process Improvement Strategic Partnerships Solar Energy Competitive Analysis Product Launch Silicon Automation Crm Go To Market Strategy Management
Norma B. Riley - Pleasanton CA Roger N. Anderson - Sunnyvale CA Grant D. Imper - San Jose CA Paul Comita - Menlo Park CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 2100
US Classification:
438710, 156345, 216 58, 458708, 458710
Abstract:
A semiconductor substrate processing chamber provides a bi-directional process gas flow for deposition or etching processes. The bi-directional gas flow provides uniformity of deposition layer thickness or uniformity of etching without the need to rotate the substrate. Junctions are provided at opposite ends of a processing chamber. Inlet and outlet ports are provided on each junction. Inlet and outlet ports on opposite junctions cooperate to provide a gas flow in a first direction for half of the process cycle, and in a second direction for the other half of the process cycle.