Gregory D Anderson

US Patent:

7271012, Sep 18, 2007

Filed:

Jul 14, 2004

Appl. No.:

10/891828

Inventors:

Gregory B. Anderson - Kissimmee FL, US

Assignee:

Control Systemation, Inc. - Orlando FL

International Classification:

G01R 31/26

US Classification:

438 14, 257E2153, 438690

Abstract:

A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.

US Patent:

20110089152, Apr 21, 2011

Filed:

Oct 16, 2009

Appl. No.:

12/580652

Inventors:

Gregory B. Anderson - Orlando FL, US

Assignee:

Control Systemation, Inc. - Orlando FL

International Classification:

B23K 26/00

US Classification:

21912169, 21912168

Abstract:

A system utilizes a laser to remove the mold compound of an IC without damaging the internal die, wire leads, solder connections and any other critical structures encapsulated within the mold compound, thereby leaving them available for the provisional and electrical analysis. A laser beam is focused through appropriate optics onto a plane corresponding to the surface of an IC. A layer of material which is opaque at the wave length of the laser beam is applied at the surface of the IC chip to be ablated prior to each pass of the laser. A spray nozzle may be provided to move in synchronous motion ahead of the laser being to apply coat of the opaque material.

US Patent:

20130248501, Sep 26, 2013

Filed:

Mar 14, 2013

Appl. No.:

13/829404

Inventors:

Gregory B. Anderson - Orlando FL, US

Assignee:

Control Laser Corporation - Orlando FL

International Classification:

B23K 26/36

US Classification:

21912169, 21912168

Abstract:

A laser wire stripping apparatus having a collet having a passageway for receiving a wire therein along an axis of insertion. The collet being fixed in position relative to the axis of insertion. A laser source for producing a laser beam. An optical assembly, the optical assembly moving relative to the collet and the axis of insertion for directing a laser beam along an axis of insertion of said wire.