Gregory M Chrysler

US Patent:

6549407, Apr 15, 2003

Filed:

Dec 27, 2001

Appl. No.:

10/034963

Inventors:

Ioan Sauciuc - Phoenix AZ
Gregory M. Chrysler - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361699, 361698, 361701, 361702, 361719, 257714, 174 151, 165 804

Abstract:

A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached to the flange.

US Patent:

6561267, May 13, 2003

Filed:

Sep 28, 2001

Appl. No.:

09/964329

Inventors:

Ioan Sauciuc - Phoenix AZ
Gregory M. Chrysler - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F28F 700

US Classification:

165185, 165 803, 174 163, 361695, 361704, 257722

Abstract:

A heat sink, is made to have a decreased thermal resistance (sink to ambient heat dissipation) and increased heat transfer coefficient by reducing the thickness of the thermal boundary layer. The heat sink includes a thermally conductive base and a plurality of fins extending from a surface of the thermally conductive base. The fins are made of a thermally conductive mesh material. Alternatively, the heat sink can include a thermally conductive base and a plurality of pins extending perpendicularly from a surface of the thermally conductive base, the plurality of pins being made of a thermally conductive material, and being arranged in a plurality of rows, and a plurality of wires extending parallel to the thermally conductive base, each of the wires connecting the pins of one of the plurality of rows.

US Patent:

6609561, Aug 26, 2003

Filed:

Dec 21, 2001

Appl. No.:

10/023989

Inventors:

Ioan Sauciuc - Phoenix AZ
Gregory M. Chrysler - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F28D 1500

US Classification:

16510433, 165 804, 16510421, 361700, 174 152, 257715

Abstract:

A phase change heat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.

US Patent:

6636423, Oct 21, 2003

Filed:

Oct 29, 2001

Appl. No.:

10/046469

Inventors:

Agostino C. Rinella - DuPont WA
Gregory M. Chrysler - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361703, 2989003, 165185, 257722

Abstract:

A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

US Patent:

6639799, Oct 28, 2003

Filed:

Dec 22, 2000

Appl. No.:

09/746554

Inventors:

Ravi Prasher - Phoenix AZ
Abhay A. Watwe - Chandler AZ
Gregory M. Chrysler - Chandler AZ
Kristopher Frutschy - Phoenix AZ
Leo Ofman - Scottsdale AZ
Ajit V. Sathe - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361700, 361699, 361203, 257714, 257715, 174 152, 165 804

Abstract:

Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

US Patent:

6646874, Nov 11, 2003

Filed:

Jun 12, 2001

Appl. No.:

09/880509

Inventors:

Himanshu Pokharna - San Jose CA
Gregory M. Chrysler - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 116

US Classification:

361687, 62 32

Abstract:

A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

US Patent:

6650542, Nov 18, 2003

Filed:

Jan 6, 2003

Appl. No.:

10/337961

Inventors:

Gregory M. Chrysler - Chandler AZ
James G. Maveety - San Jose CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361699, 361698, 361704, 257714, 174 151, 165 804, 16510433

Abstract:

Embodiments in accordance with the present invention provides active thermal management of the heat generated at localized hot spots on the microelectronic die by using fluid impingement cooling. The combination of orifices constructed using piezoelectric microelectromechanical systems (MEMs) technology, fluid impingement for maximizing the heat transfer coefficient, and embedded thermal diodes within the microelectronic die for measuring local temperature, to produce an active, closed-loop flow-control system for managing hot spots. A small reservoir of fluid is stationed a small distance above the die. The base of the reservoir has an array of piezoelectric orifices embedded within it, and positioned over the hotspot(s). The piezoelectric orifices can be opened and closed depending on the voltage applied.

US Patent:

6653730, Nov 25, 2003

Filed:

Dec 14, 2000

Appl. No.:

09/737117

Inventors:

Gregory M. Chrysler - Chandler AZ
Abhay A. Watwe - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2334

US Classification:

257704, 257712, 257713

Abstract:

To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.