Gregory D Stone

US Patent:

45602077, Dec 24, 1985

Filed:

Mar 1, 1984

Appl. No.:

6/585051

Inventors:

Larry G. Eftefield - Edelstein IL
Gerald P. Simmons - Morton IL
Gregory L. Stone - Peoria IL

Assignee:

Caterpillar Tractor Co. - Peoria IL

International Classification:

E21C 3700

US Classification:

299 10

Abstract:

A method and apparatus for laterally severing an asphalt layer to form a ribbon, separating the asphalt ribbon from an underlying base, elevating the separated asphalt ribbon, and fracturing the elevated asphalt ribbon by bending same. A cutting member having a leading edge which is insertable between the asphalt ribbon and base provides separation thereof along a lateral line. A ramp and elevating structure elevatingly guide the separated asphalt ribbon into a pair of breaker drums which are rotatable in opposite circumferential directions. Each breaker drum has protruding teeth which are arranged in laterally separated circumferential rows with the teeth in adjacent circumferential rows being preferably arcuately offset. Corresponding circumferential rows on the opposed breaker drums are laterally aligned and the teeth in those rows engage opposite surfaces of the asphalt ribbon during rotation of the breaker drums. The teeth in corresponding rows on the respective breaker drums alternately engage opposite surfaces of the asphalt ribbon at longitudinally spaced locations to bend and fracture the asphalt ribbon by displacing it in generally opposite transverse directions at the engaged locations.

US Patent:

20170032991, Feb 2, 2017

Filed:

Oct 17, 2016

Appl. No.:

15/295943

Inventors:

- Santa Clara CA, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/673
H01L 21/78
H01L 21/683
H01L 21/67
H01L 21/677

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

US Patent:

20160172222, Jun 16, 2016

Filed:

Feb 22, 2016

Appl. No.:

15/050387

Inventors:

- Santa Clara CA, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/673
H01L 21/683
H01L 21/78
H01L 21/67
H01L 21/677

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

US Patent:

20150187622, Jul 2, 2015

Filed:

Dec 28, 2013

Appl. No.:

14/142761

Inventors:

John C. JOHNSON - Phoenix AZ, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/677
H05K 13/00
H01L 21/687
H01L 21/78
H01L 21/683

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.