Gregory S Stone

US Patent:

20170032991, Feb 2, 2017

Filed:

Oct 17, 2016

Appl. No.:

15/295943

Inventors:

- Santa Clara CA, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/673
H01L 21/78
H01L 21/683
H01L 21/67
H01L 21/677

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

US Patent:

20160172222, Jun 16, 2016

Filed:

Feb 22, 2016

Appl. No.:

15/050387

Inventors:

- Santa Clara CA, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/673
H01L 21/683
H01L 21/78
H01L 21/67
H01L 21/677

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

US Patent:

20150187622, Jul 2, 2015

Filed:

Dec 28, 2013

Appl. No.:

14/142761

Inventors:

John C. JOHNSON - Phoenix AZ, US
Sandeep B. SANE - Chandler AZ, US
Sandeep RAZDAN - Chandler AZ, US
Edward R. PRACK - Phoenix AZ, US
Leonel R. ARANA - Phoenix AZ, US
Peter A. DAVISON - Puyallup WA, US
Eric J. MORET - Beaverton OR, US
Lawrence M. PALANUK - Portland OR, US
Gregory A. STONE - Beaverton OR, US

International Classification:

H01L 21/677
H05K 13/00
H01L 21/687
H01L 21/78
H01L 21/683

Abstract:

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.