Hal R Canter

US Patent:

7521791, Apr 21, 2009

Filed:

Mar 8, 2006

Appl. No.:

11/370631

Inventors:

Justin R. Wodrich - Plantation FL, US
Michael S. Beard - Boca Raton FL, US
Hal R. Canter - Weston FL, US
Anbuselvan Kuppusamy - Plantation FL, US
Zalman Schwartzman - Rehovot, IL
James L. Stephens - Pembroke Pines FL, US
Kathleen Farrell, legal representative - Wellington FL, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 23/10
H01L 23/34

US Classification:

257706, 257703, 257718, 257720

Abstract:

An apparatus () is provided for dispersing heat from an integrated circuit () to a heat sink (). The apparatus () is formed on a nonconductive body () having at least two conductive surfaces () disposed thereon. One of the conductive surfaces () is reflowed to a heat generating lead of the integrated circuit (), and the other conductive surface () provides a surface for contacting a heat sink (). The apparatus () and integrated circuit provide a package () which can be tape and reeled () for easy mounting to a printed circuit board () of a communication device ().

US Patent:

20050121496, Jun 9, 2005

Filed:

Feb 23, 2004

Appl. No.:

10/786578

Inventors:

Kevin Farrell - Wellington FL, US
Edwin Bradley - Coral Springs FL, US
Hal Canter - Weston FL, US
Gene Kim - Plantation FL, US
David McClintock - Davie FL, US

International Classification:

B23K037/04

US Classification:

228049100, 228049500

Abstract:

A solid solder element (), such as a solder perform, is attached onto a contact surface of interest (), such as a heat sink using and adhesive material (). Placement of the adhesive material overcomes alignment and registration issues that may interfere with good contact to components (), such as transistors, during the manufacturing/assembly process, such as a reflow process.

US Patent:

56475292, Jul 15, 1997

Filed:

Mar 10, 1995

Appl. No.:

8/402294

Inventors:

Henry F. Liebman - Tamarac FL
Anthony J. Suppelsa - Coral Springs FL
Hal R. Canter - Fort Lauderdale FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

228222

Abstract:

A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

US Patent:

58605835, Jan 19, 1999

Filed:

Jul 1, 1996

Appl. No.:

8/675313

Inventors:

Henry F. Liebman - Tamarac FL
Anthony J. Suppelsa - Coral Springs FL
Hal R. Canter - Fort Lauderdale FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 308

US Classification:

228 46

Abstract:

An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.