Harold M Mortensen from Saratoga, CA

Us Patents

High Temperature Ceramic Heater Assembly With Rf Capability
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US Patent:

6616767, Sep 9, 2003
Filed:

Mar 27, 1998
Appl. No.:

09/057005
Inventors:

Jun Zhao - Cupertino CA
Talex Sajoto - San Jose CA
Charles Dornfest - Fremont CA
Harold Mortensen - Carlsbad CA
Richard Palicka - San Clemente CA
Assignee:

Applied Materials, Inc. - Santa Clara CA
International Classification:

C23C 1600
US Classification:

118723, 15634547
Abstract:

The present invention provides techniques for coupling radio-frequency (RF) power to a metal plate in a ceramic pedestal. Perforations in the metal plate allow ceramic-to-ceramic bonding through the metal plate. The power from an RF power feed is distributed to the perforated metal plate via several electrodes that are spaced away from the centerline of the RF power feed, thus splitting power distribution. A ceramic bonding disk between the metal plate and the RF power feed provides mechanical support for the metal plate and a ceramic body to bond to through the perforations, thus reducing cracking of the metal plate and the surrounding ceramic material.

System And Method For An Improved Susceptor
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US Patent:

7098428, Aug 29, 2006
Filed:

Jan 26, 2005
Appl. No.:

11/044153
Inventors:

Brent Elliot - Cupertino CA, US
Frank Balma - Monte Sereno CA, US
Alexander Veytser - Mountain View CA, US
Benjamin Mosser - San Diego CA, US
Harold H. Mortensen - Carlsbad CA, US
International Classification:

H05B 3/68
C23C 16/00
US Classification:

2194441, 118724
Abstract:

A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.

Ceramic Heater With Thermal Pipe For Improving Temperature Uniformity, Efficiency And Robustness And Manufacturing Method
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US Patent:

20030019858, Jan 30, 2003
Filed:

Jul 27, 2001
Appl. No.:

09/921369
Inventors:

Charles Dornfest - Fremont CA, US
Harold Mortensen - Carlsbad CA, US
Richard Palicka - San Clemente CA, US
Assignee:

APPLIED MATERIALS, INC.
International Classification:

B23K010/00
US Classification:

219/158000, 219/121430, 118/725000
Abstract:

A ceramic heater for heating a substrate in a semiconductor manufacturing apparatus is disclosed. The ceramic heater, which contains a thermal heat pipe made from Graphfoil embedded in, e.g., AIN, permits

Ceramic Susceptor With Embedded Metal Electrode And Eutectic Connection
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US Patent:

56330731, May 27, 1997
Filed:

Jul 14, 1995
Appl. No.:

8/502585
Inventors:

David W. Cheung - Foster City CA
Mark A. Fodor - Los Gatos CA
Christopher Lane - Sunnyvale CA
Harold H. Mortensen - Carlsbad CA
Assignee:

Applied Materials, Inc. - Santa Clara CA
Cercom, Inc - Vista CA
International Classification:

B32B 900
US Classification:

428209
Abstract:

A ceramic susceptor with an embedded metal electrode. The metal electrode has multiple apertures, and the ceramic material is cross-linked through the apertures. An electrical connection to the electrode protects the electrode from the environment in the processing chamber. The ceramic may be aluminum nitride, and the metal electrode may be a mesh of molybdenum wires. To form the electrical connection, the susceptor may be heated until an eutectic forms between a conductive connector and the metal electrode. Alternately, a brazing material may be placed between the metal layer and a conductive connector.

High Temperature Ceramic Heater Assembly With Rf Capability And Related Methods
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US Patent:

59683791, Oct 19, 1999
Filed:

Feb 12, 1997
Appl. No.:

8/800096
Inventors:

Jun Zhao - Cupertino CA
Charles Dornfest - Fremont CA
Talex Sajoto - San Jose CA
Leonid Selyutin - San Leandro CA
Stefan Wolff - Sunnyvale CA
Lee Luo - Fremont CA
Harold Mortensen - Carlsbad CA
Richard Palicka - San Clemete CA
Assignee:

Applied Materials, Inc. - Santa Clara CA
International Classification:

B23K 1000
US Classification:

21912152
Abstract:

The present invention provides systems, methods and apparatus for depositing titanium films at rates up to 200. ANG. /minute on semiconductor substrates from a titanium tetrachloride source. In accordance with an embodiment of the invention, a ceramic heater assembly with an integrated RF plane for bottom powered RF capability allows PECVD deposition at a temperature of at least 400. degree. C. for more efficient plasma treatment. A thermal choke isolates the heater from its support shaft, reducing the thermal gradient across the heater to reduce the risk of breakage and improving temperature uniformity of the heater. A deposition system incorporates a flow restrictor ring and other features that allow a 15 liters/minute flow rate through the chamber with minimal backside deposition and minimized deposition on the bottom of the chamber, thereby reducing the frequency of chamber cleanings, and reducing clean time and seasoning. Deposition and clean processes are also further embodiments of the present invention.