Technical Account Manager at Yarbrough Solutions Worldwide
Location:
Phoenix, Arizona Area
Industry:
Semiconductors
Work:
Yarbrough Solutions Worldwide - Gilbert, Arizona since Aug 2013
Technical Account Manager
ASM - Phoenix, Arizona Area Jan 2012 - Jul 2013
NPI Engineer
Ingenious Solutions Feb 2007 - Mar 2012
CMP Consultant
Rubicon Technology Jan 2011 - Sep 2011
Sr. Polish Engineer
Clarkson University Oct 2008 - Jun 2010
CMP Engineer
Education:
University of Phoenix 2005 - 2005
Semiconductor Training 1993 - 1998
US Navy Advanced Electronics 1987 - 1992
US Navy Advanced Electronics 1986 - 1986
US Navy Electronics School 1986 - 1986
Jan 2011 to Sep 2011 Sr. Polish EngineerClarkson University
Oct 2008 to Jun 2010 CMP EngineerSt. Lawrence Nanotechnology, Inc.
Jun 2008 to Jun 2010 Senior Project ManagerThomas West, Inc.
Jan 2001 to Feb 2007 Technical Account ManagerSpeedFam-IPEC
Jul 1999 to Jan 2001 Sales Director, TaiwanNovellus Systems
1999 to 2001 Sales Director, TaiwanIPEC International Services
Feb 1998 to Jul 1999 General Manager, Taiwan BranchIntraco Taiwan Corporation
Jan 1996 to Feb 1998 Customer Support ManagerIPEC Planar
Mar 1995 to Oct 1995 Customer Support RepresentativeSEMATECH
Dec 1993 to Mar 1995 Senior Equipment Maintenance TechnicianUnited States Navy
Nov 1985 to Dec 1993 Electronics Technician, First Class Petty OfficerUS Navy
1985 to 1993 Electronics Technician Petty Officer First Class
Education:
University of Phoenix Jan 2005 to Jan 2005 Business Management CoursesSemiconductor Training Jan 1993 to Jan 1998 Various semiconductor training coursesUS Navy Advanced Electronics Jan 1987 to Jan 1992 Advanced electronic training courses for communications, cryptographic, radar, and navigationUS Navy Advanced Electronics Jan 1986 to Jan 1986 Electronic Theory and Fault Isolation, Advanced ElectronicsUS Navy Electronics School Jan 1986 to Jan 1986 Basic Electricity and Electronics School
Skills:
Expert in troubleshooting both equipment and process related problems with a long background in both. Strong ability for product development and customer support.
Us Patents
Single Component Pad Backer For Polishing Head Of An Orbital Chemical Mechanical Polishing Machine And Method Therefor
A pad backer for a polishing head of an orbital chemical mechanical polishing (CMP) machine is formed of a flexible pad. A plurality of holes are formed through the flexible pad. The holes are used to accommodate tile flow of a polishing liquid from the underside of the flexible pad. A plurality of grooves are formed on a backside of the flexible pad for transferring a liquid during the polishing process.