Hassan Sameer Ali

US Patent:

7173498, Feb 6, 2007

Filed:

Sep 28, 2004

Appl. No.:

10/952343

Inventors:

Sridhar Ramaswamy - Plano TX, US
Hassan O. Ali - Richardson TX, US
Song Wu - Plano TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H03B 5/12
H03B 1/04
H03B 5/08
H01L 29/41

US Classification:

331108C, 331105, 331167, 257778, 257784

Abstract:

Disclosed are integrated circuits having multiple electromagnetically emissive devices, such as LC oscillators. The devices are formed on an integrated circuit substrate and are given different planar orientations from each other. Particular integrated circuit packages disclosed are “flip-chip” packages, in which solder bumps are provided on the integrated circuit substrate for flipping and mounting of the finished integrated circuit upon a printed circuit board or other substrate. The solder bumps provide conductive connections between the integrated circuit and the substrate. The orientations and positioning of the emissive devices are such that one or more of the solder bumps are interposed between neighboring emissive devices to act as an electromagnetic shield between them.

US Patent:

20130058329, Mar 7, 2013

Filed:

Sep 6, 2011

Appl. No.:

13/226133

Inventors:

Nirmal C. Warke - Irving TX, US
Brad Kramer - Plano TX, US
Hassan Ali - Murphy TX, US
Swaminathan Sankaran - Plano TX, US
Baher Haroun - Allen TX, US
Srinath Hosur - Plano TX, US
Martin J. Izzard - Dallas TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H04L 12/50

US Classification:

370359

Abstract:

Conventional routers employ a wired backplane that employs “long reach” serializer/deserializer (SerDes) links, but this type of architecture is complicated, costly, and uses a considerable amount of power. To address some of these issues, a new wireless backplane architecture is provided here. This wireless backplane employs direct millimeter wave links between line cards that replaces the convention, wired switching fabric.

US Patent:

20130058330, Mar 7, 2013

Filed:

Sep 6, 2011

Appl. No.:

13/226164

Inventors:

Nirmal C. Warke - Irving TX, US
Brad Kramer - Plano TX, US
Hassan Ali - Murphy TX, US
Swaminathan Sankaran - Plano TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H04L 12/50

US Classification:

370359

Abstract:

Conventional routers employ a wired backplane that employs “long reach” serializer/deserializer (SerDes) links, but this type of architecture is complicated, costly, and uses a considerable amount of power. To address some of these issues, a new wireless backplane architecture is provided here. This wireless backplane employs direct millimeter wave links between line cards that replaces the convention, wired switching fabric.

US Patent:

20130265732, Oct 10, 2013

Filed:

Apr 4, 2012

Appl. No.:

13/439557

Inventors:

Juan A. Herbsommer - Allen TX, US
Robert F. Payne - Lucas TX, US
Marco Corsi - Parker TX, US
Baher S. Haroun - Allen TX, US
Hassan Ali - Murphy TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H05K 1/11
H05K 1/18

US Classification:

361774

Abstract:

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

US Patent:

20130265733, Oct 10, 2013

Filed:

Apr 4, 2012

Appl. No.:

13/439621

Inventors:

Juan A. Herbsommer - Allen TX, US
Robert F. Payne - Lucas TX, US
Marco Corsi - Parker TX, US
Baher S. Haroun - Allen TX, US
Hassan Ali - Murphy TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H05K 1/11
H05K 1/18

US Classification:

361774

Abstract:

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

US Patent:

20130265734, Oct 10, 2013

Filed:

Apr 4, 2012

Appl. No.:

13/439646

Inventors:

Juan A. Herbsommer - Allen TX, US
Robert F. Payne - Lucas TX, US
Marco Corsi - Parker TX, US
Baher S. Haroun - Allen TX, US
Hassan Ali - Murphy TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H05K 1/14
H05K 1/11

US Classification:

361783

Abstract:

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

US Patent:

20130300627, Nov 14, 2013

Filed:

May 8, 2012

Appl. No.:

13/466956

Inventors:

Swaminathan Sankaran - Plano TX, US
Nirmal C. Warke - Irving TX, US
Hassan Ali - Murphy TX, US
Brad Kramer - Plano TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01P 5/22
H01P 11/00
H01Q 21/00

US Classification:

343853, 333120, 29600

Abstract:

An apparatus is provided. First and second hybrid couplers are provided with each having a first port, a second port, a third port, a fourth port and with each being substantially curvilinear. The fourth ports of the first and second hybrid couplers are first and second isolation port that are mutually coupled. The first port of the first hybrid coupler is configured to carry a first portion of a differential signal, and the first port of the second hybrid coupler is configured to carry a second portion of the differential signal.

US Patent:

20220336383, Oct 20, 2022

Filed:

Apr 15, 2021

Appl. No.:

17/231897

Inventors:

- Dallas TX, US
Hassan Omar Ali - Murphy TX, US
Baher Haroun - Allen TX, US
Yigi Tang - Allen TX, US
Rajen Manicon Murugan - Dallas TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 23/66
H01L 23/495
H01L 21/48

Abstract:

A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.