Helen H Li

US Patent:

20120007199, Jan 12, 2012

Filed:

Nov 30, 2010

Appl. No.:

12/957095

Inventors:

Helen Hongwei Li - San Jose CA, US
Joy Ellen Jones - Fremont CA, US
Phillip J. Benzel - Pleasonton CA, US
Jeanne M. McNamara - St. Cloud FL, US
John T. Gasner - Satellite Beach FL, US

Assignee:

INTERSIL AMERICAS INC. - Milpitas CA

International Classification:

H01L 31/0232
H01L 21/302
H01L 21/768

US Classification:

257432, 438612, 438694, 257E2159, 257E21214, 257E31127

Abstract:

A method for opening a bond pad on a semiconductor device is provided. The method comprises removing a first layer to expose a first portion of the bond pad and forming a protective layer over the exposed first portion of the bond pad. The method further comprises performing subsequent processing of the semiconductor device and removing the protective layer to expose a second portion of the bond pad.

US Patent:

20120241893, Sep 27, 2012

Filed:

Jun 7, 2012

Appl. No.:

13/491195

Inventors:

Helen Hongwei Li - San Jose CA, US
Joy Ellen Jones - Fremont CA, US
Phillip J. Benzel - Pleasonton CA, US
Jeanne M. McNamara - St. Cloud FL, US
John T. Gasner - Satellite Beach FL, US

Assignee:

INTERSIL AMERICAS INC. - Milpitas CA

International Classification:

H01L 31/0232

US Classification:

257432, 257E31127

Abstract:

A device having a detector includes a sensor package. The sensor package includes a light sensor, at least one filter located over the light sensor and at least one bond pad. The light sensor is formed on a semiconductor device that provides sensor information related to light incident upon the light sensor. A perimeter of each bond pad is covered by a protective layer forming a sidewall seal. The sensor package also includes a package that encases the light sensor, filter(s) and bond pad(s). Additionally, at least one package pin is communicatively coupled to the bond pad(s). The device also includes a functional circuit that is coupled to the sensor package and receives the sensor information from the light sensor. The device can be an ambient light sensor, camera, backlit mirror, handheld electronic device, filter device, light-to-digital output sensor, gain selection device, proximity sensor, or light-to-voltage non-linear converter.

US Patent:

20130298311, Nov 14, 2013

Filed:

May 13, 2013

Appl. No.:

13/893245

Inventors:

Kip Gerenda - Richmond CA, US
Jessica Riquetti - Richmond CA, US
Steven Yui - Richmond CA, US
Helen Li - Richmond CA, US

Assignee:

MOUNTAIN HARDWEAR, INC. - Portland OR

International Classification:

A41D 1/06
A44B 11/22

US Classification:

2235, 24 68 E

Abstract:

Embodiments herein provide pants with an integrated pants closure system for securing the pants to a waist of a user. The closure system may provide a plurality of points of closure, such as a belt, a fly, and an internal panel closure. The closure system may provide a low-profile for a front portion and/or waistband of the pants. Additionally, the closure system may provide backup points of closure in case of failure. The belt may include a buckle with a finger that extends through a loop in the belt to close the belt. The fly may include a zipper that extends to a top edge of the waistband. The internal panel may include one or more low-profile snaps to secure the internal panel to an inside surface of the pants and/or waistband.

US Patent:

20150118438, Apr 30, 2015

Filed:

Oct 27, 2014

Appl. No.:

14/525074

Inventors:

- Portland OR, US
Helen Li - Richmond CA, US

International Classification:

A41D 31/02
B32B 3/28
B32B 3/06
D05B 1/02
B32B 7/12
B32B 7/04
B32B 37/00
B32B 38/00
B32B 1/00
B32B 7/08

US Classification:

428101, 156164, 11247509, 2458

Abstract:

Embodiments of insulation materials, and methods of their formation, are disclosed herein. In some embodiments, an insulating material may include a stretchable scrim layer, a face layer, and an insulation layer disposed between the scrim layer and the face layer. First and second seams may couple the stretchable scrim layer, the insulation layer, and the face layer, and a length of the face material between the first and second seams is greater than a length of the stretchable scrim between the first and second seams. Other embodiments may be disclosed and/or claimed.