Heng Yang

US Patent:

8466560, Jun 18, 2013

Filed:

Dec 30, 2010

Appl. No.:

12/982784

Inventors:

John H. Zhang - Fishkill NY,
Heng Yang - Fishkill NY,

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

H01L 23/522
H01L 21/768

US Classification:

257774, 257E23142, 257E21585, 257773, 257784, 257786

Abstract:

A method of forming dummy structures in accordance with the golden ratio to reduce dishing and erosion during a chemical mechanical polish. The method includes determining at least one unfilled portion of a die prior to a chemical mechanical planarization and filling the at least one unfilled portion with a plurality of dummy structures, a ratio of the dummy structures to a total area of the unfilled portion being in the range of 36 percent and 39 percent. A die formed in accordance with the method may include a plurality of metal levels and a plurality of regions at each metal level, each region having a plurality of dummy structures formed as golden rectangles.