Heng Yang

age ~42

from Austin, TX

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Also known as:

Heng Yang Heng

Connected to:

Heng Yang Phones & Addresses

Austin, TX
Pasadena, CA
Danbury, CT
Palo Alto, CA
Chicago, IL
Detroit, MI

Work

Company:

Ant capital partners
Dec 2011
Position:

Winter intern

Education

School / High School:

University of Southern California- Los Angeles, CA
2013
Specialities:

Bachelor of Arts in Economics

Skills

Fluent in written and oral communication... • Excel • PowerPoint • Bloomberg and Dreamweaver

Resumes

Researcher At System Centroid

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Location:

Greater Los Angeles Area

Industry:

Computer Software

Heng Yang

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Location:

1306 Wilson Heights Dr, Austin, TX 78746

Industry:

Pharmaceuticals

Work:

Heb Jun 2013 - Jun 2015
Pharmacy Intern
Boehringer Ingelheim Nov 2008 - Feb 2011
Scientist Iii
Cytokinetics May 2007 - Sep 2008
Research Associate Ii

Education:

The University of Texas at Austin 2012 - 2016
Doctorates, Doctor of Pharmacy, Pharmacy Wayne State University School of Medicine 2004 - 2006
Masters Peking University 1999 - 2003
Bachelors, Bachelor of Science, Pharmacy The University of Texas at Austin, College of Pharmacy

Skills:

Drug Discovery

Heng Yang

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Heng Yang Los Angeles, CA

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Work:

Ant Capital Partners

Dec 2011 to Jan 2012
Winter Intern University of Southern California
Los Angeles, CA
Sep 2011 to Dec 2011
Grader PricewaterhouseCoopers

Jun 2011 to Aug 2011
Summer intern DBS
Tapei, Taiwan
Jun 2010 to Aug 2010
Group Strategic Marketing and Communication Intern

Education:

University of Southern California
Los Angeles, CA
2013
Bachelor of Arts in Economics

Skills:

Fluent in written and oral communication in Mandarin Basic communication skills in French Microsoft Word, Excel, PowerPoint, Bloomberg and Dreamweaver

Name / Title

Company / Classification

Phones & Addresses

Heng Yang

Nordkapp LLC
Holding Company · Manufacturing of Building Materials for · Nonclassifiable Establishments

304 Tejon Pl, Palos Verdes Estates, CA 90274

Us Patents

Dummy Structures Having A Golden Ratio And Method For Forming The Same
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US Patent:

8466560, Jun 18, 2013
Filed:

Dec 30, 2010
Appl. No.:

12/982784
Inventors:

John H. Zhang - Fishkill NY, US
Heng Yang - Fishkill NY, US
Assignee:

STMicroelectronics, Inc. - Coppell TX
International Classification:

H01L 23/522
H01L 21/768
US Classification:

257774, 257E23142, 257E21585, 257773, 257784, 257786
Abstract:

A method of forming dummy structures in accordance with the golden ratio to reduce dishing and erosion during a chemical mechanical polish. The method includes determining at least one unfilled portion of a die prior to a chemical mechanical planarization and filling the at least one unfilled portion with a plurality of dummy structures, a ratio of the dummy structures to a total area of the unfilled portion being in the range of 36 percent and 39 percent. A die formed in accordance with the method may include a plurality of metal levels and a plurality of regions at each metal level, each region having a plurality of dummy structures formed as golden rectangles.