Hien D Phan

US Patent:

20120211214, Aug 23, 2012

Filed:

Dec 9, 2011

Appl. No.:

13/316403

Inventors:

Hien Van Phan - Cypress CA, US

International Classification:

F28F 7/00
B23P 15/26

US Classification:

165185, 2989003

Abstract:

A heatsink device and methods for manufacturing and using same. The heatsink device includes a plurality of heatsink fins that extend from a heatsink base. Each heatsink fin has a distal end region and a proximal end region disposed adjacent to the heatsink base. A fin width of each heatsink fin progressively decreases from the proximal end region to the distal end region in accordance with a parabolic profile such that opposing fin profiles of adjacent heatsink fins define an air space that is parabolic. The parabolic chamfer advantageously promotes full heat flow from the heatsink base to the heatsink fins and removes more heat than conventional heatsink devices. When applied in conjunction with a heat-generating component, the heatsink can enable the heat-generating component to operate at a lower stabilized component temperature. Accordingly, the performance, reliability, safety, and operational lifetime of the heat-generating component can be increased.