Hienvu Chuc Nguyen

US Patent:

20070261268, Nov 15, 2007

Filed:

May 9, 2006

Appl. No.:

11/430210

Inventors:

Hienvu Nguyen - Fair Oaks CA, US

International Classification:

A43B 7/06
A43B 13/38
A61F 5/14

US Classification:

036044000, 036140000, 03600300B

Abstract:

A new insole is consisting of shock absorbing and shear reducing composite layers of Poron or soft EVA for the bottom layer, Plastazote or cushioned polymer gel for the middle layer, and a closed cell Neoprene top cover. Through out the insole, there are evenly spaced 3/16″ holes through only the bottom and the middle layer of the insole. These holes are ″ away from each other and in square patterns. The holes will significantly reduce the direct plantar pressure and shear stress dynamically exerting on the plantar skin upon loading. When there is a focal point of pressure, the holes in the bottom 2 layers will be distorted or stretched to the direction of the pressure which will also allow the insole material to distorted or “give” resulting in reduction of the peak plantar pressure.

US Patent:

20040168354, Sep 2, 2004

Filed:

Jan 23, 2004

Appl. No.:

10/762613

Inventors:

Hienvu Nguyen - Elk Grove CA, US

International Classification:

A43B013/38

US Classification:

036/043000

Abstract:

The main purpose of this invention is to develop a new insole design which can significantly reduce the plantar pressure under the forefoot and heel, and can be used as replacement insole for the diabetic shoe, diabetic healing shoe, and removable cast walker. This new insole is consisting of shock absorbing and shear reducing composite layers of Poron or soft EVA for the bottom layer, Plastazote or cushioned polymer gel for the middle layer, and a closed cell Neoprene top cover. These materials are commercially available in sheets. The main advantage and uniqueness of this invention, comparing to other existing insoles, are the evenly spaced holes throughout the insole. The holes will significantly reduce the direct plantar pressure and shear stress dynamically exerting on the plantar skin upon loading. When there is a focal point of pressure, the holes will be distorted or stretched to the direction of the pressure which will also allow the insole material to distorted or “give” resulting in reduction of the peak plantar pressure and the associated shear stress. This will also eliminate any pressure transferring problems as encountered in other insoles. Removing the pressure will allow the insole material to return back to the original state. Therefore, dynamic direct plantar pressure and shear stress can be significantly reduced by these holes.