Melia F. Gordon - Nagasaki, JP Charles Ray Johns - Austin TX, US Hiroki Kihara - Austin TX, US Iwao Takiguchi - Kanagawa, JP Tetsuji Tamura - Tokyo, JP Michael Fan Wang - Austin TX, US Kazuaki Yazawa - Chiba, JP Munehiro Yoshida - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03K 17/78
US Classification:
327512, 374 1, 702 99, 702130
Abstract:
An integrated circuit die is disclosed including a temperature detection circuit and a memory configured to store calibration data. The temperature detection circuit is operatively coupled to the memory, and receives an input signal. The temperature detection circuit is configured to produce an output signal dependent upon the input signal and indicative of whether a temperature of the integrated circuit die is greater than a selected temperature. During a normal operating mode of the integrated circuit die the input signal comprises the calibration data. A system and methods for calibrating the temperature detection circuit are also described.
David William Boerstler - Round Rock TX, US Eric John Lukes - Stewartville MN, US Hiroki Kihara - Austin TX, US James David Strom - Rochester MN, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03K 21/00
US Classification:
327115, 377 47, 377 48
Abstract:
The present invention provides for state correction. A first value in a state circuit is received from a flip flop. The received value is transmitted to a second flip flop. The received value within the second flip flop is altered if an error condition arises. The received value is transmitted to a third flip flop. In one aspect, the received value transmitted to the third flip flop comprises an unaltered received value. In another aspect, the received value transmitted to the third flip flop comprises transmitting an altered received value. This allows for an incorrect state within the state machine to change to a correct state after a few clock pulses.
David William Boerstler - Round Rock TX, US Eric John Lukes - Stewartville MN, US Hiroki Kihara - Austin TX, US James David Strom - Rochester MN, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03K 21/00 H03K 23/00 H03K 25/00
US Classification:
327115, 327117
Abstract:
The present invention provides for a self-correcting state circuit. A first flip flop is configured to receive a clock input and a first data input, and to generate a first output in response to the clock input and the first data input. A second flip flop is coupled to the first flip flop and configured to receive the clock input and to receive the first output as a second data input, and to generate a second output in response to the clock input and the first output. A first correction circuit is coupled to the second flip flop and configured to generate a corrected output. A third flip flop is coupled to the first correction circuit and configured to receive the clock input and to receive the corrected output as a third data input, and to generate a third output in response to the clock input and the third data input.
Munehiro Yoshida - Austin TX, US Daniel Stasiak - Austin TX, US Michael F. Wang - Austin TX, US Charles R. Johns - Austin TX, US Hiroki Kihara - Austin TX, US Tetsuji Tamura - Tokyo, JP Kazuaki Yazawa - Chiba, JP Iwao Takiguchi - Kanagawa, JP
Assignee:
Kabushiki Kaisha Toshiba - Tokyo International Business Machines Corporation - Armonk NY Sony Computer Entertainment Inc. - Tokyo
International Classification:
H01L 23/58
US Classification:
257 48, 257467, 257E29347, 257E23179
Abstract:
Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.
David William Boerstler - Round Rock TX, US Eric John Lukes - Stewartville MN, US Hiroki Kihara - Austin TX, US James David Strom - Rochester MN, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03K 21/00
US Classification:
377 47, 377 48, 327115, 327117
Abstract:
The present invention provides for a self-correcting state circuit. A first flip flop is configured to receive a clock input and a first data input, and to generate a first output in response to the clock input and the first data input. A second flip flop is coupled to the first flip flop and configured to receive the clock input and to receive the first output as a second data input, and to generate a second output in response to the clock input and the first output. A first correction circuit is coupled to the second flip flop and configured to generate a corrected output. A third flip flop is coupled to the first correction circuit and configured to receive the clock input and to receive the corrected output as a third data input, and to generate a third output in response to the clock input and the third data input.
Thermal Protection For A Vlsi Chip Through Reduced C4 Usage
David Boerstler - Round Rock TX, US Hiroki Kihara - Austin TX, US Robert Putney - Round Rock TX, US Daniel Stasiak - Rochester MN, US Michael Wang - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY Sony Computer Entertainment Inc. - Tokyo
International Classification:
G06F015/00
US Classification:
702130000
Abstract:
The present invention provides for determining a temperature in a chip. A voltage across a thermal diode is generated. It is then determined whether the voltage across the first thermal diode exceeds a threshold value. The voltage is correlated with a range of values. The determination of whether the voltage across the thermal diode exceeds the threshold value is correlated with the correlation of the voltage with a range of values. Through the use of voltage level sensors, the use of C4 input/output pins are avoided.
High Frequency Divider State Correction Circuit With Data Path Correction
The present invention provides for state correction. A first flip flop coupled to a second flip flop. A state correction circuit coupled to the output of the second flip flop. A third flip flop is coupled to the output of the state correction circuit. A fourth flip flop is coupled to the output of the third flip flop.